Heat dissipation method of LED lamp and LED lamp adopting same

A technology of LED lamps and heat dissipation methods, which is applied to cooling/heating devices of lighting devices, lighting and heating equipment, parts of lighting devices, etc., can solve problems such as poor heat dissipation, and achieve easy production, high luminous efficiency, and luminous The effect of low shading

Inactive Publication Date: 2010-05-12
王景慧
View PDF1 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a heat dissipation method for an LED lamp and an LED lamp using the heat dissipation method. There is a problem of poor heat dissipation of LED bulbs, so that the original size glass bulbs or spotlight cups can be installed with LED light sources with higher luminous efficiency, so that traditional light bulb lamps and spotlights do not need to be redesigned for LED light sources.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation method of LED lamp and LED lamp adopting same
  • Heat dissipation method of LED lamp and LED lamp adopting same
  • Heat dissipation method of LED lamp and LED lamp adopting same

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0029] Embodiment one

[0030] A kind of LED lamp, refer to figure 1 , including a lamp holder 1, a plastic shell 2, a glass shell 3, a heat dissipation component 4, an LED assembly 5 and a power supply module for powering the LED assembly 5, which is not shown in the figure. The plastic case 2 is connected between the lamp cap 1 and the glass case 3 , and the above-mentioned power module can be arranged in the plastic case 2 to supply power for each LED assembly 5 . The heat dissipation component 4 is built in the glass shell 3, and a heat transfer cavity 30 is formed between the heat dissipation component 4 and the glass shell 3, and the heat transfer cavity 30 is filled with a heat transfer medium gas. Each LED assembly 5 is pasted on the heat dissipation component 5 through the heat conduction substrate 51 .

[0031] refer to figure 1 , the heat dissipation component 4 is a cup-shaped body with a stepped side wall. Each LED assembly 5 is arranged on the bottom surface of

Example Embodiment

[0033] Embodiment two

[0034] refer to figure 2 , the structure of this embodiment is basically the same as that of Embodiment 1, the only difference is that each LED assembly 5 of this embodiment is arranged on the side of each step of the cup-shaped heat dissipation part 4, and the side of each step is a tapered surface, Therefore, the light emitting angle of this embodiment is larger than that of the first embodiment.

Example Embodiment

[0035] Embodiment Three

[0036] refer to image 3 , the structure of this embodiment is basically the same as that of Embodiment 1, the difference between the two is that the cup mouth of the cup-shaped heat dissipation part 4 faces the side of the glass shell 3, and the heat dissipation part 4 is concave inward when viewed from the side of the glass shell 3 of. Each LED assembly 5 is also arranged on the bottom surface of each step of the cup-shaped heat dissipation component 4 . In order to adapt to the shape of the heat dissipation part 4 , the shape of the glass envelope 3 of this embodiment is also different from that of the first embodiment.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to an LED lamp improved heat dissipation structure. The method and the structure mainly comprises: an LED component is attached on a heat dissipation part through a heat conduction base plate, the heat dissipation part and the LED component are together encapsulated in a glass shell which is filled with heat conduction medium gas; when the LED component gives out light, the heat emitted by the component is conducted to the heat conduction medium gas through the heat dissipation part, then conducted to the glass shell through the heat conduction medium gas and diffused outside by the glass shell. The heat dissipation structure can elastically enlarge the heat dissipation area according to the power of the LED component, and therefore the heat of the LED component can be released totally and quickly and uniformly dispersed to the low-temperature part of the glass shell for heat dissipation by means of the evaporation heat of heat superconduction media in a heat transfer cavity body. The heat conduction mode of the used heat superconduction media is two-dimensional and a surface heat conduction mode with excellent heat dissipation effect.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner 王景慧
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products