Gold stripping composition and using method thereof
一种组成物、剥金的技术,应用在剥金组成物领域,能够解决损害底材、伤害底材、底材失效等问题,达到有效率回收金、快速剥金的效果
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[0023] Further understanding of the composition of the present invention and its method of use can be obtained through the following detailed description of the invention.
[0024] The present invention provides a composition for stripping gold from a substrate, wherein the composition includes one or more gold stripping compounds and a conductive compound; wherein the gold stripping compound can form a covalent bond with gold Junction, so that the gold on the substrate is stripped off, and through the action of the conductive compound, the voltage can be reduced without damaging the substrate to complete the gold stripping, wherein the composition does not include any cyanide.
[0025] In one embodiment, the gold stripping compound of the present invention includes Thiocarbamide. Of course, the stripping gold compound may further include one or more of sulfate salts with alkyl groups, compounds with pyridinesulfonic acid, and compounds with triacetic acid.
[0026] In anothe...
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