Ultra-precision machining method for gallium oxide substrate

An ultra-precision machining and gallium oxide technology, which is applied in metal processing equipment, manufacturing tools, grinding devices, etc., can solve the problems of high cost of consumables, no consideration of cleavage of crystal materials, and no cleavage of sapphire, etc., to achieve processing The effect of cost reduction, avoiding processing difficulty and rising processing cost

Active Publication Date: 2016-01-27
南京大劲精密机械有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology relates to reducing waste during manufacturing processes by providing an eco-friendly solution for green production while also being able to use less expensive raw material without compromising its quality. Additionally, this new approach allows for simplified handling of complicated machining operations with fewer technical means than current methods like abrasive waterjet cutting tools.

Problems solved by technology

This patented technical solution describes how it was hoped to improve the efficiency and accuracy of producing pure galliium nitride monocrystalline wafers by reducing damage caused when handling these types of material. However, current methods used for this purpose may lead to poor results due to differences between alkalinity levels found within each type of element being processed.

Method used

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  • Ultra-precision machining method for gallium oxide substrate
  • Ultra-precision machining method for gallium oxide substrate
  • Ultra-precision machining method for gallium oxide substrate

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with specific embodiments.

[0028] figure 1 It is the process flow chart of traditional sapphire ultra-precision machining, figure 2 It is a process flow chart of the ultra-precision machining method for gallium oxide substrates of the present invention.

[0029] Abrasive particle size classification representation method: particle size number "W", particle size unit "micron"; abrasive particle size increases with the increase in the value after "W", for example, W0.5 means that the abrasive particle size distribution is less than 0.5 micron Within the range, W1.5 means that the abrasive particle size distribution range is between 0.5 and 1.5 microns. In addition, the particle size number can also be expressed by "mesh". The abrasive particle size becomes smaller with the increase of the "mesh" value. There are different standards for screen specifications in different countries and industries, so the

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Abstract

The invention discloses an ultra-precision machining method for a gallium oxide substrate and belongs to the technical field of machining of an original semiconductor. The ultra-precision machining method includes the following steps that firstly, slicing is conducted, wherein a gallium oxide crystal is sliced, and a gallium oxide crystal substrate blank is obtained; secondly, grinding is conducted; thirdly, polishing is conducted, namely, according to rough polishing, silk is used as a polishing gasket, rough polishing is conducted on the ground gallium oxide crystal substrate, the gallium oxide crystal substrate obtained after rough polishing is obtained, according to finishing polishing, silk is used as a polishing gasket, finishing polishing is conducted on the gallium oxide crystal substrate obtained after rough polishing, the gallium oxide crystal substrate obtained after finishing polishing is obtained, and diamond polishing paste is used as a polishing addition agent; and fourthly, cleaning is conducted. The ultra-precision machining method has the beneficial effects that green machining is conducted, and environment friendliness is achieved since the polishing paste and the silk used in the method belong to green and non-pollution consumables, and pressure cannot be caused to the environment at all; low-cost machining is achieved due to the fact that the consumables used in the method are low-cost materials; and machining steps are simplified.

Description

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Claims

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Application Information

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Owner 南京大劲精密机械有限公司
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