Printed circuit board element for forming enhancement mode biosensing module and fabrication method for printed circuit board element

The invention provides a printed circuit board element for forming an enhancement mode biosensing module and a fabrication method for the printed circuit board element. The printed circuit board element comprises a printed circuit board, a biosensing chip and a protection layer, wherein the printed circuit board comprises an insulating layer and a conductive layer; the conductive layer forms a working circuit, an excitation circuit, multiple first connecting point welding pads and multiple second connecting point welding pads on a part of the upper surface of the insulating layer, wherein the second connecting point welding pads are connected to the excitation circuit; the biosensing chip is assembled on the printed circuit board; the biosensing chip comprises a sensing region, an excitation signal source, multiple combination welding pads and multiple conductive elements; each combination welding pad is electrically connected to the corresponding first connecting point welding pad; the excitation signal source is connected to the excitation circuit through the combination welding pads and used for providing an excitation signal; each conductive element is assembled on the corresponding second connecting point welding pad; and the protection layer is formed on and covers the printed circuit board, the biosensing chip and the conductive elements. According to the printed circuit board element, cracking of the protection layer can be avoided by virtue of the light and thin dimensions of the conductive elements.