Backplane quality control method

A backplane and control technology, which is applied in the field of production process and backplane quality control, can solve the problems of residual drying impurities in drilling holes, outflow of processing fluid, and complex number of drilling holes, so as to prevent bad loss, ensure production quality, The effect of accurate information

Inactive Publication Date: 2017-08-25
重庆通灿电子有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The back plate is a high-precision stamping part, which has strict requirements on thickness, and the number of drilling h

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Backplane quality control method
  • Backplane quality control method
  • Backplane quality control method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0071] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0072] like figure 1 As shown, a backplane quality control method comprises the following steps,

[0073] Step 1, incoming material inspection;

[0074] Step 2, receiving materials;

[0075] In said step 2, receiving materials is divided into two links, S1, stamping process self-inspection; S2, IPQC random inspection;

[0076] Step three, cleaning;

[0077] Step four, packaging;

[0078] In the step 4, the packaging is divided into two links, Y1, packaging process; Y2, IPQC random inspection;

[0079] Step five, storage inspection;

[0080] Step six, shipping.

[0081] The operating conditions of the tank cleaning machine are the pre-order work of the backboard packaging, so it is particularly important. It should be pointed out that dry

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Flatnessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a backboard quality control method, which relates to computer, display, TV, mobile phone, copier and other optoelectronic product components and accessories, and is used to solve the problem of how to control the key quality characteristics of the backboard and avoid any drying remaining at the drilled hole. The problem of impurities. It includes step 1, incoming material inspection; step 2, receiving materials; in the second step, receiving materials is divided into two links, S1, stamping process self-inspection; S2, IPQC random inspection; step 3, cleaning; step 4, packaging ; In the step 4, the packaging is divided into two links, Y1, packaging process; Y2, IPQC random inspection; step 5, warehousing inspection; step 6, shipment. Improve the pass rate of products by improving the intermediate links of quality control.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner 重庆通灿电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products