Automatic high speed exposure device and method for circuit board

An exposure method and circuit board technology, which are applied in the field of circuit board manufacturing, can solve problems such as inability to meet circuit boards, and achieve the effects of simplifying structure, improving exposure efficiency, and reducing production costs.

Pending Publication Date: 2019-10-25
广东科视光学技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The production capacity of the traditional fully automatic exposure machine in the solder mask exposure process ca

Method used

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  • Automatic high speed exposure device and method for circuit board
  • Automatic high speed exposure device and method for circuit board
  • Automatic high speed exposure device and method for circuit board

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[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0044] figure 1 It is a flowchart of a fully automatic high-speed exposure method for circuit boards in an embodiment of the present invention, and the fully automatic high-speed exposure method for circuit boards includes the following steps S11-S17.

[0045] S11. Moving the circuit board to a loading station.

[0046] S12. Make the feeding lifting mechanism lift up the first working frame to receive the circuit board. Wherein, the first working frame includes

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Abstract

The invention discloses an automatic high speed exposure device and method for a circuit board. The method comprises steps that a circuit board is moved to a loading station; a loading lifting mechanism is utilized to jack up a first working frame to receive the circuit board; the first working frame is reset; a second working frame at an alignment exposure station is made to exchange with the first working frame in position; an alignment lifting mechanism is utilized to jack up the first working frame, and the circuit board on the first working frame is subjected to the alignment exposure process; the loading lifting mechanism is utilized to jack up the second working frame to receive the circuit board; the first working frame and the second working frame are reset and exchanged in position. The method is advantaged in that the two working frames are alternately utilized to perform circuit board receiving and circuit board exposure, exposure efficiency is improved, and the output is improved.

Description

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Claims

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Application Information

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Owner 广东科视光学技术股份有限公司
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