Multi-chip package structure and manufacturing method thereof

The invention discloses a multi-chip package structure. The multi-chip package structure comprises a plastic package layer, a first chip, a connection plate, a second chip, a glue filling layer, a rewiring layer, a dielectric layer and an external welding ball, wherein the first chip is coated in the plastic package layer and is provided with a first pin and a second pin, a first surface of the connection plate is connected with the plastic package layer, a chip embedment groove and a conductive through hole are formed in the connection plate, the conductive through hole is electrically connected with the first pin of the first chip, the second chip is arranged in the chip embedment groove of the connection plate and is electrically connected with the second pin of the first chip, the gluefilling layer is filled in a gap between the second chip and the chip embedment groove and covers the second chip, the rewiring layer is arranged on the second surface of the connection plate and iselectrically connected with the conductive through hole, the dielectric layer is arranged on the second surface of the connection plate and is used for insulation protection among layers of the rewiring layers and among same-layer metal, and the external welding ball is electrically connected with the rewiring layer.