Chip and electronic equipment

A technology of electronic equipment and chips, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of chip junction temperature rise, retention, chip failure, etc., and achieve the effect of improving heat dissipation performance and service life

Active Publication Date: 2020-01-17
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology allows for better cooling on electronic devices without adding extra parts like fans or liquid pipes. It involves incorporating an electrically insulating layer between two components called chips - these components generate excess thermal energy when they work together at high speeds. By allowing some of this thermal energy to be transferred from one component back into another component instead it becomes easier to remove any unwanted waste products outwardly during normal operation.

Problems solved by technology

The technical problem addressed by this patented technology relates to how excessive temperatures can damage certain parts (chips) within these chips that are sensitive to high levels of heat generated during their operation.

Method used

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  • Chip and electronic equipment
  • Chip and electronic equipment
  • Chip and electronic equipment

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Embodiment Construction

[0046] The following are preferred embodiments of the application. It should be pointed out that for those skilled in the art, without departing from the principle of the application, some improvements and modifications can also be made, and these improvements and modifications are also considered as the present invention. The scope of protection applied for.

[0047] Please refer to figure 1 . figure 1 It is a schematic structural diagram of the chip according to the first embodiment of the present application. This embodiment provides a chip 1 , the chip 1 includes: a base material 10 , and the base material 10 includes a substrate 100 and a plurality of first solder balls 110 carried on the substrate 100 . The functional module 20, the functional module 20 and the first solder ball 110 are respectively disposed on opposite sides of the substrate 100, and the functional module 20 dissipates heat during operation. The heat conduction device 300, the heat conduction device 300

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Abstract

The invention provides a chip and electronic equipment. The chip comprises a base material, a functional module and a heat conduction device. The base material comprises a substrate and a plurality offirst welding balls borne on the substrate. The functional module and the first welding balls are arranged on the two opposite sides of the substrate respectively. The heat conduction device comprises a first heat conduction piece and a heat conduction wire, the first heat conduction piece and the first welding balls are arranged on the two opposite sides of the substrate respectively, and the first heat conduction piece is connected with the functional module. The heat conduction wire is connected with the first heat conduction piece and the plurality of first welding balls. A heat conduction device is additionally arranged in a chip; the first heat conduction piece is connected with the functional module; the heat conduction wire is connected with the first heat conduction piece and theplurality of first welding balls; therefore, the functional module is connected with the first welding balls in the base material, heat generated in the functional module can be conducted to the welding balls through the first heat conduction piece and the heat conduction wire, heat in the chip is conducted to the outside of the chip, heat in the chip is reduced, heat dissipation is achieved, theheat dissipation performance of the chip is improved, and the service life of the chip is prolonged.

Description

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Claims

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Application Information

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Owner YANGTZE MEMORY TECH CO LTD
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