Silicon wafer continuous extraction device

An extraction device and silicon wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of small size of silicon wafers, difficult equipment implementation, and different degrees of depression of silicon wafers, and prevent cracking. Effect

Active Publication Date: 2020-02-14
徐州博创建设发展集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The end of the existing high-quality silicon wafer is not in a flat state, and there will be a certain radian depression. After the silicon wafer is processed and formed, there will be more or less burrs at the end. , so these burrs must be deburred, and the size of

Method used

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Example Embodiment

[0030] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention will be further explained below in conjunction with specific embodiments.

[0031] As an embodiment of the present invention, the present invention proposes a continuous extraction device for silicon wafers, including an adsorption extraction component, vacuum adsorption extraction silicon wafers, including a vacuum distributor and an adsorption carrier, the output shaft of the vacuum distributor is connected with Suction carrier. The suction carrier is used for adsorbing silicon wafers. The suction carrier includes a tray body and a plurality of suction holes. The tray body includes opposite bottom and top surfaces, and a surrounding surface extending from the periphery of the bottom surface to the periphery of the top surface , The recess is formed in the trench on the side of the surrounding surface. The trench extends t

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Abstract

The invention relates to the field of silicon wafer processing and particularly relates to a silicon wafer continuous extraction device, which comprises an adsorption extraction assembly. The adsorption extraction assembly comprises a vacuum distributor and an adsorption tray; an output shaft of the vacuum distributor is connected with the adsorption tray; an angle adjusting assembly comprises anangle adjuster and a mounting base; a support frame is arranged at the side part of the vacuum distributor; the angle adjuster is mounted on the support frame; a mounting frame is arranged on the support frame; one end of the mounting base is hinged with the mounting frame; the other end of the mounting base is hinged with an output shaft of the angle adjuster; the vacuum distributor is mounted onthe mounting base; a height adjusting assembly comprises a height adjuster; the height adjuster is fixed on the mounting base; an output shaft of the height adjuster is in transmission connection with the vacuum distributor and the vacuum distributor is driven to be close or away from the mounting frame. The grooves of the tray body can allow overflowing glue to flow in, so that the situation that the glue leaks between the silicon wafer and the tray body and blocks the suction holes of the tray body to cause reduction of an adsorption force is avoided, and the situation in which the siliconwafer shakes and is broken due to insufficient adsorption force is prevented.

Description

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Claims

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Application Information

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Owner 徐州博创建设发展集团有限公司
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