Laser processing equipment

A laser processing and equipment technology, which is applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of affecting processing accuracy, rack bending deformation, and increasing costs

Inactive Publication Date: 2020-09-25
PENTA CHUTIAN LASER (WENZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the size of laser cutting increases, the frame bears the cutting equipment and the object stage, and it is easy to cause the frame to bend and deform due to the heavy load, which affects the processing accuracy.
If higher strength materials are used, the cost will be greatly increased

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be described in further detail below in conjunction with the embodiments given in the accompanying drawings.

[0020] refer to Figure 1 to Figure 5 As shown, a laser processing equipment of the present embodiment includes a stage 1 and a cutting device, and a support frame 2 is respectively arranged on both sides of the stage 1, and the support frame 2 and the stage 1 are separately arranged, and the cutting The device comprises a rail car 3 and a cutting mechanism 4, the top of the support frame 2 is provided with a first slide rail 8, the rail car 3 is arranged on the first slide rail 8, the cutting mechanism 4 is arranged on the rail car 3, and the rail car 3 is arranged There is a drive mechanism 6 for driving the cutting mechanism 4 to move laterally on the railcar 3 .

[0021] The support frame 2 and the loading table 1 are set separately, the cutting device is installed on the supporting frame 2, the supporting frame 2 bears the weigh...

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PUM

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Abstract

The invention discloses laser processing equipment. The laser processing equipment comprises an object stage and a cutting device, wherein supporting frames are arranged on two sides of the object stage, and the supporting frames and the object stage are arranged in a split manner; the cutting device comprises a railcar and a cutting mechanism; a first sliding rail is arranged at the top of each supporting frame; the railcar is arranged on the first sliding rails; the cutting mechanism is arranged on the railcar; and a driving mechanism for driving the cutting mechanism to move in the railcarin the horizontal direction is arranged on the railcar. According to the laser processing equipment disclosed by the invention, the supporting frames and the object stage are arranged in a split manner, the cutting device is mounted on the supporting frames, the supporting frames are used for bearing the weight of the cutting device, the object stage only needs to bear the weight of a steel plate,and the bearing is separated, so that the problem that in the design of a single machine frame, when a large-scale steel plate is processed, the machine frame is liable to deform, and the processingaccuracy is influenced is solved.

Description

technical field [0001] The invention relates to a laser device, more specifically to a laser processing device with greater load-bearing capacity. Background technique [0002] A common laser cutting machine generally has an integrated frame, and then an object table and a cutting device are installed on the frame. However, as the size of laser cutting increases, the frame bears the cutting equipment and the loading table, and it is easy to bend and deform the frame due to the heavy load, which affects the processing accuracy. If higher strength materials are used, the cost will be greatly increased. Contents of the invention [0003] Aiming at the deficiencies in the prior art, the object of the present invention is to provide a laser machining equipment capable of carrying a greater weight. [0004] In order to achieve the above object, the present invention provides the following technical solutions: a laser processing equipment, including a stage and a cutting device...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/142B23K26/38B23K26/70
CPCB23K26/38B23K26/142B23K26/702
Inventor 石志敏杨忠明徐侠陈亮付兴威
Owner PENTA CHUTIAN LASER (WENZHOU) CO LTD
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