12 results about "Laser processing" patented technology

The present invention generally relates to a laser processing systems for thermally processing substrates. The laser processing systems include a shield disposed between an energy source of the laser processing system and a substrate which is to be thermally processed. The shield includes an optically transparent window disposed adjacent to a cavity within the shield. The optically transparent window allows annealing energy to pass therethrough and to illuminate the substrate. The shield also includes one or more gas inlets and one or more gas outlets for introducing and removing a purge gas from the cavity within the shield. The purge gas is utilized to remove volatized or ablated components during thermal processing, and to provide a gas of predetermined composition, such as oxygen-free, to the thermally processed area.

Disclosed herein is a laser processing apparatus including first and second laser mechanisms, a laser oscillator for oscillating an original laser beam, an optical system for branching the original laser beam into first and second laser beams, and first and second operation panels for respectively setting first and second processing conditions for the first and second laser mechanisms. The first and second laser mechanisms include first and second chuck tables for holding first and second workpieces, first and second X moving units for moving the first and second chuck tables in an X direction, first and second Y moving units for moving the first and second chuck tables in a Y direction perpendicular to the X direction, and first and second focusing units for focusing the first and second laser beams to the first and second workpieces held on the first and second chuck tables, respectively.

The embodiment of the invention discloses a laser light path system and a double-head laser marking machine, and relates to the technical field of laser processing equipment. The light path system comprises a laser generator, a light path input module, a light splitting module, a light path output module and a light emitting control module, the laser emitted by the laser generator is guided into the light splitting module through the light path input module, the light splitting module is used for dividing the laser into two beams, the light path output module is used for outputting the laser,the light emitting control module is used for controlling the laser in the light splitting module to pass through the light path output module. According to the provided laser light path system, a vertical light path structure is adopted, the light path input module, the light splitting module and the light path output module each are independently provided with light path structures, moreover, the light path structures communicate with one another, and the laser light path system is simple and compact in structure, high in light path stability and high in light beam quality.

The invention relates to a special water-cooling reflecting cover for laser processing, belongs to the technical field of laser processing, aims to overcome the defect of no special reflecting covers for laser processing in the conventional market, and provides a novel and special water-cooling reflecting cover for laser processing. The water-cooling reflecting cover comprises a reflecting cover upper part and a reflecting cover lower part, wherein the reflecting cover upper part comprises a reflecting cover upper part main body, a water-cooling water inlet, a laser beam through hole, an internal thread interface, screw holes, an external sealing ring groove upper part, an internal sealing ring groove upper part and a water-cooling groove upper part; the reflecting cover lower part comprises a reflecting cover lower part main body, a water outlet, a laser beam through hole, screw holes, an external sealing ring groove lower part, an internal sealing ring groove lower part and a water-cooling groove lower part; the reflecting cover upper part and the reflecting cover lower part are both in shapes of an arc with camber, and are connected with each other through bolts. The water-cooling reflecting cover can effectively cover the processing region in the laser processing process, and fully absorbs reflected laser; meanwhile, a water-cooling system can prevent the water-cooling reflecting cover from overheating, and guarantees safety of the personnel and devices nearby.

The invention relates to the technical field of laser processing, in particular to a filter for decomposing a galvanometer and a servo position. A Bessel filter is of a high-order structure with 4-10orders; preferably, a seven-order Bessel filter. The seven-order Bessel filter comprises a first-order filter and three second-order filters, and the first-order filter and the three second-order filters are connected in series. Compared with the prior art, the seven-order Bessel digital filter has the beneficial effects that the seven-order Bessel digital filter has maximum flat group delay and constant group delay, so that a servo motion track keeps a low-frequency track shape in a passband, the impact on a mechanism is small, and a better acceleration and deceleration effect is achieved. Byusing the seven-order Bessel digital filter, the galvanometer position response is fast, and the synchronization with the servo position can be satisfied, so that the whole track is synchronous, andthe processing effect is the best.

The invention discloses an inner hole cladding laser head, and belongs to the technical field of laser processing. The inner hole cladding laser head comprises a light passing pipe, a protective mirror assembly, a reflecting mirror assembly arranged at one end of the light passing pipe, a first protective assembly, a powder feeding nozzle assembly and a second protective assembly. The protective mirror assembly is arranged at the position, corresponding to the reflecting mirror assembly, of one side of the light passing pipe, and the reflecting mirror assembly reflects the laser beam in the light passing pipe to the protective mirror assembly. The reflector assembly reflects the laser beam into a strip-shaped light spot. The first protection assembly is arranged below the protection glass assembly. The powder feeding nozzle assembly is arranged on one side of the protective glass assembly, a discharging opening of the powder feeding nozzle assembly faces the lower portion of the first protective assembly, and the powder feeding nozzle assembly can spray out the cladding material in a long-strip shape. The second protection assembly is arranged on the powder feeding nozzle assembly and provided with a first air outlet, and the first air outlet is formed above the discharging port. According to the method, cladding can be smoother, the repairing effect is improved, and the service life is prolonged.

According to the method for improving the quality of the inner wall of the laser-processed micropore based on the dual cavitation effect, post-treatment strengthening is conducted on the laser-processed micropore based on the dual cavitation effect of laser cavitation and ultrasonic cavitation, and a large number of cavitation bubbles can be generated through the dual cavitation effect; the residual tensile stress on the inner wall of the micropore is changed into pressure stress by the local shock wave effect generated by cavitation collapse, the distribution of the residual pressure stress on the inner wall of the micropore can be improved, the generation trend of microcracks on the wall of the micropore is reduced, and the generation of the microcracks is effectively reduced or even prevented, so that the mechanical property of the micropore area is effectively improved. The laser cavitation is precisely positioned in a micropore processing area, so that the cavitation strengthening effect on the micropore inner wall area can be ensured. A large number of cavitation bubbles can be generated through ultrasonic cavitation, and the defect that the number of the cavitation bubbles is small under the laser cavitation effect is overcome. According to the method, a water temperature adjusting mode is adopted, the maximum diameter value of the cavitation bubbles is reduced, and the cavitation effect is more obvious and effective. In addition, the ultrasonic vibration also has the effects of ultrasonic cleaning and grain refinement, so that the defects caused by laser drilling are further reduced, and the application field of laser drilling is widened.

The invention relates to the field of material laser processing technologies, in particular to a large-breadth laser hole cutting method for glass, which comprises the following steps of: corroding a material by focusing a laser scanning beam on the lower surface of a glass workpiece; in the rapid scanning process of the focused laser beam, the three-dimensional motion platform drives the glass workpiece to move in an xy plane along a set cutting track to form a large-format kerf, after one-time scanning is completed, the three-dimensional motion platform moves the glass workpiece to move downwards, and the kerf is finally deepened in the glass thickness until the kerf penetrates through the glass; and after the kerf is penetrated, the excess material falls off to form a hole. Aiming at the defect that the current glass laser hole cutting cannot meet the requirement of large breadth, the invention provides a laser cutting method with the advantages of rapid formation of kerfs and large-breadth hole characteristics, and the laser hole cutting breadth is expanded to be more than 1m * 1m, so that the glass large-breadth laser hole cutting scheme can be applied to various glass processing industries.