Simulation method for hot air drying process of fungus material

The invention discloses a simulation method for a hot air drying process of a fungus material, and the method comprises the steps: building a physical model of a porous medium pore channel network ofthe fungus material according to the corresponding relation between the structural composition of the fungus material and the porous medium pore channel network structure; dispersing the fungus material medium calculation area into three parts, namely a skeleton, a pore node and a pore channel; simplifying the topological structure of the model according to the actual material related physical property characteristic parameters; establishing a pore channel network mathematical model for fungus material drying and mass transfer; establishing a fungus material drying heat transfer mathematical model based on a pore network; setting initial conditions and boundary conditions of mass transfer and initial conditions and boundary conditions of heat transfer; and solving the fungus material drying mass and heat transfer mathematical model established in the steps 4 and 5 by adopting a staggered grid. The method can comprehensively consider the heat and mass coupling complex transmission process of moisture between frameworks, between pore channels and between the frameworks and the pore channels in the drying process, and lays a foundation for analysis of the drying mechanism of high-heat-sensitivity and high-activity materials.