Photomask manufacturing method, photomask, photoetching method, medium, module and photoetching machine

A photomask and photolithography technology, which is applied in the field of microelectronics, can solve problems such as poor surface flatness of wafers or workpieces, pattern defocus, transfer accuracy of feature patterns, and reduced yield.

Pending Publication Date: 2022-04-15
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In a type of process represented by the manufacture of dual Damascene DD (Dual Damascene) groove structures, the pattern density of the front layer is uneven, and uneven coating of filling materials is prone to occur.
In addition, poor wafer or workpiece

Method used

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  • Photomask manufacturing method, photomask, photoetching method, medium, module and photoetching machine
  • Photomask manufacturing method, photomask, photoetching method, medium, module and photoetching machine
  • Photomask manufacturing method, photomask, photoetching method, medium, module and photoetching machine

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Embodiment Construction

[0070] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. Of course, the specific embodiments described below are only for explaining the technical solution of the present invention, rather than limiting the present invention.

[0071] In addition, the parts described in the embodiments or the drawings are only illustrations of relevant parts of the present invention, rather than the entirety of the present invention.

[0072] Such as figure 2 As shown, in order to solve the technical problem of photolithography defocusing, the embodiment of the present invention discloses a method for making a mask that can match the surface topography of a wafer or workpiece; by detecting the surface of the workpiece, the surface topography is represented in layers , and then achieve matching with the above-mentioned surface topography through a multi-layer photomask.

[0073] Specifically, such as figure 2 , quant

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Abstract

The invention belongs to the technical field of microelectronics, and particularly relates to a photomask manufacturing method, a photomask, a photoetching method, a medium, a module and a photoetching machine. On the basis of application scenes such as a multi-step wafer, the adverse working condition in which photoetching defocus possibly occurs is specifically designed; through a composite photomask structure, the matching of the photomask and the surface of the wafer is realized; shading surfaces with different resolutions or intensities can be arranged according to requirements so as to adapt to wafer surfaces or workpieces with different shapes; the focal plane is matched according to the morphology, so that the photoetching precision and the yield can be improved.

Description

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Claims

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Application Information

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Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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