Push-pull force testing device for laminated packaging

A technology of push-pull force testing and stack packaging, which is applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problems of low detection efficiency, chip replacement and long detection time, etc., to improve work efficiency, replacement efficiency and detection efficiency , Improve the effect of detection results

Inactive Publication Date: 2022-05-13
深圳市比创达电子科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the actual detection process, in order to improve the stability of the chip in the push-pull test, the chip is usually clamped and fixed by the fixture,

Method used

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  • Push-pull force testing device for laminated packaging
  • Push-pull force testing device for laminated packaging
  • Push-pull force testing device for laminated packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] refer to figure 1 , the push-pull force testing device comprises a base 1, one end of the upper side of the base 1 is fixedly connected with a frame 2, and a push-pull force gauge 21 is slidably connected to the frame 2 along the vertical direction, and the inside of the frame 2 is arranged to drive the push-pull force gauge 21 to lift A lifting device, a test needle 22 is fixedly connected to the side of the push-pull force gauge 21 facing the base 1 .

[0044] The other end on the upper side of the base 1 is provided with a workbench 3 , and a moving mechanism 4 connecting the two is provided between the base 1 and the workbench 3 . The moving mechanism 4 includes a first moving assembly 41 that moves along the Y-axis direction and a second moving assembly 42 that moves along the X-axis direction. Chips to be inspected are placed on the workbench 3 , wherein the chips are made by a package-on-package process.

[0045] refer to figure 1 and figure 2 , the first moving

Embodiment 2

[0066] refer to Figure 9 and Figure 10 , the difference from Embodiment 1 is that a support assembly 31 for supporting and stabilizing the chip is provided between the workbench 3 and the pressing plate 5, the support assembly 31 includes a support block 311 parallel to the moving direction of the chip, one end of the support block 311 is connected to the working Table 3 is fixedly connected, and the other end is facing the pressing plate 5, and one end of the supporting block 311 facing the pressing plate 5 is connected with a number of supporting wheels 312 distributed along the length direction of the supporting block 311, and the circumference of the supporting wheel 312 is fixed with a number of evenly distributed suction cups 313 , the suction cup 313 on the side of the support wheel 312 close to the platen 5 presses against and adsorbs on the side wall of the chip.

[0067] When the chip moved in translation between the workbench 3 and the pressing plate 5, the suction

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Abstract

The invention relates to a push-pull force testing device for laminated packaging, and belongs to chip testing equipment, the push-pull force testing device for laminated packaging comprises a base, the base is provided with a rack used for pushing and pulling a chip, the base is provided with a workbench moving in a plane, a pressing plate is arranged above the workbench, the pressing plate is provided with a working opening facing the rack, and the working opening faces the rack. A channel for the chip to move is arranged between the pressing plate and the workbench, and a clamping mechanism for clamping and moving the chip is arranged in the channel. The method has the advantages that the chip is convenient to replace, and the detection efficiency of the chip is improved.

Description

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Claims

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Application Information

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Owner 深圳市比创达电子科技有限公司
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