Read circuit of nonvolatile semiconductor memory

a nonvolatile semiconductor and read circuit technology, applied in static storage, digital storage, instruments, etc., can solve the problems of inability to reduce the value icell in the first term on the right side, the inability to simultaneously achieve faster read operation and lower power consumption, and the inability to perform a fast read. , to achieve the effect of reducing the consumption of current and performing a fast read

Inactive Publication Date: 2005-01-18
KK TOSHIBA
View PDF24 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology solves problems with traditional methods used in non- volatile memories such as flash EEPROMs (electrically erasable programmable Read Only Memory). It allows for faster data transfer without consuming too much power.

Problems solved by technology

The technical problem addressed in this patent is how to improve the performance of a nonvolatile semiconductor memory device called a NAND type flash memory, particularly in terms of its read speed and energy efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Read circuit of nonvolatile semiconductor memory
  • Read circuit of nonvolatile semiconductor memory
  • Read circuit of nonvolatile semiconductor memory

Examples

Experimental program
Comparison scheme
Effect test

modification 1

3.1. Modification 1

FIGS. 16 and 17 show main components of a read circuit according to the present invention.

This read circuit is characterized by the configuration of a precharge circuit for use in precharging and sensing the bit line BLj, as compared with the read circuit shown in FIGS. 6 and 7.

Specifically, in this modification, the sense amplifier S / Ai excludes the inverter INV2 as shown in FIG. 6. More specifically, the VCLAMP node 37 is connected directly to gates of MOS transistors MI1, MI2′.

In this configuration, as ATD3 transitions to “H” (in the bit line precharge period), the bit line BLj (BLS node 34 and SA node 33) is supplied with charges from the MOS transistor MI2′ to precharge the bit line BLj. The precharge level is determined by Vdd, the diode-connected MOS transistor ML4, and the like.

In the read circuit of this modification, since a constant potential is maintained at a gate of the MOS transistor MI2′ at all times, the MOS transistor MI2′ must be large in size (c

modification 2

3.2. Modification 2

FIG. 18 shows main components of a read circuit according to the present invention.

In comparison with the read circuit of FIGS. 6 and 7, this read circuit is characterized in that the potential at the gate of the MOS transistor MI3 in the SAREF generating circuit 19 is generated by a mechanism similar to the inverter INV2 in FIG. 6.

Specifically, an inverter INV4 corresponds to the inverter INV2 in FIG. 6, and a charging circuit (comprised of MOS transistors MP13, MI6, ML5, MN15) corresponds to the precharge circuit (comprised of MOS transistors MP8, MI2, ML4, MN6) in FIG. 6.

The sense amplifier S / Ai of the read circuit shown in FIG. 18 is identical in internal configuration to the sense amplifier S / Ai shown in FIG. 6.

With the configuration described above, since a circuit for generating the potential at the gate of the MOS transistor MI1 (see FIG. 6) has completely the same configuration as a circuit for generating the potential at the gate of the MOS transistor M

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

An INVSRC node and a SAREF node are previously precharged. After a potential on a bit line is reset, the bit line (BLS node) is precharged. In this event, a clamp MOS transistor in a sense amplifier is in ON state, and an SA node is also precharged simultaneously. A precharge level is set to a value lower than a threshold voltage of an inverter. Subsequently, when SAEN transitions to “H,” a sense operation is performed. For reading data “0,” the SA node is rapidly increased to Vdd. For reading data “1,” the SA node slowly approaches to Vss. A change in the potential at the SA node is detected by the inverter.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner KK TOSHIBA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products