Method for fabricating MOS field effect transistor
a field effect transistor and transistor technology, applied in the direction of semiconductor devices, basic electric elements, electrical equipment, etc., can solve the problems of void generation, deterioration of device reliability, and failure to perform silicide process
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[0018] Embodiments of the present invention are described with reference to the accompanying drawings. It is to be understood that the invention is not limited to the disclosed embodiments, but rather is intended to cover various modifications and arrangements within the scope of the claims.
[0019]FIGS. 8-14 are sectional views illustrating a method of fabricating a MOS field effect transistor according to the present invention.
[0020] As shown in FIG. 8, a gate insulating film 201 and a gate conductive film 202 are formed on a semiconductor substrate 200. Preferably, the films 201 and 202 are sequentially formed. In a preferred embodiment, the gate insulating film 201 is formed from an oxide film and the gate conductive film 202 is formed from a polysilicon film.
[0021] A mask pattern 203, which is used to pattern the gate conductive film 202, is formed on the gate conductive film 202. The mask pattern 203 acts as a photoresist pattern.
[0022] As shown in FIG. 9, an exposed portion...
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