Connection structure of high frequency lines and optical transmission module using the connection structure
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[0029] Referring to FIGS. 3A to 4E, a first embodiment of the structure and method for connecting two transmission lines according to the invention will be described. One of transmission lines is a coplanar line with a ground and will be referred to as a component 3. The other of transmission lines is a microstrip line and will be referred to as a component 4. By connecting the signal wiring patterns of the two components 3 and 4 and by connecting the ground conductors of the two components 3 and 4, the two transmission lines are connected.
[0030] As shown in FIG. 3A, the lower component 3 includes a dielectric 303, a signal wiring pattern 301 and a ground conductor 304 both disposed on an upper surface of the dielectric 303, and a ground conductor 302 disposed on a lower surface of the dielectric 303.
[0031] In the first embodiment, the lower component 3 further includes a conductor 3001 disposed at an end surface thereof. The conductor 3001 is disposed perpendicular to the signal wir
Example
[0052] Now referring to FIGS. 6A to 7E, a second embodiment of the structure and method for connecting two transmission lines according to the invention will be described. One of transmission lines is a coplanar line with a ground and will be referred to as a component 5. The other of transmission lines is a microstrip line and will be referred to as a component 6. By connecting the signal wiring patterns of the two components 5 and 6 and by connecting the ground conductors of the two components 5 and 6, the two transmission lines are connected.
[0053] As shown in FIG. 6A, the lower component 5 includes a dielectric 503, a signal wiring pattern 501 and a ground conductor 504 both disposed at an upper surface of the dielectric 503, and a ground conductor 502 disposed on a lower surface of the dielectric 503.
[0054] In the second embodiment, the component 5 further includes a conductor 5001 disposed at an end surface thereof. The conductor 5001 is disposed perpendicular to the signal wir
Example
[0063] Now referring to FIGS. 8A through 9E, a third embodiment of the structure and method for connecting two transmission lines according to the invention will be described. One of transmission lines is a microstrip line and will be referred to as a component 7. The other of transmission lines is a coplanar line with a ground and will be referred to as a component 8. By connecting the signal wiring patterns of the two components 7 and 8 and by connecting the ground conductors of the two components 7 and 8, the two transmission lines are connected.
[0064] As shown in FIG. 8A, the lower component 7 includes a dielectric 703, a signal wiring pattern 701 disposed on an upper surface of the dielectric 703, and a ground conductor 702 disposed on a lower surface of the dielectric 703.
[0065] In the third embodiment, the lower component 7 further includes a conductor 7001 disposed on an end surface thereof. The conductor 7001 is disposed perpendicular to the signal wiring pattern 701, such t
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