Slider, manufacturing method thereof, and head suspension assembly with the same

[0083] Performing the step S1-S3 shown in FIG. 5 step by step and cutting the wafer with compound read / write elements incorporated therein into a plurality of slices with a predetermined size, and forming a plurality of sample row bars (similar to the row bars 116 shown in FIG. 6b, i.e. a plurality of bars with a same structure) by such as a diamond cutter.

[0084] The sample row bar has a multi-filmed configuration as shown in FIGS. 2-4, which comprises an AlTiC base plate acting as the wafer of the substrate 1, an aluminum layer with a thickness of 5 μm functioning as the undercoat 2, a permalloy layer with a thickness of 2 μm serving as the bottom magnetic-shielding layer 3, a Ta layer with a thickness of 0.05 μm used as the first covering layer 4, a GMR element 20 (a more detailed illustration will be given later), a Ta layer with a thickness of 0.05 μm used as the second covering layer 7, a permalloy layer with a thickness of 4 μm as the top magnetic-shielding layer 8, and a NiFe