Resistor body based on carbon film nano conductive material and preparation method thereof
A nano-conductive and resistive technology, which is applied in the coating process of metal materials, the use of electrical devices, the use of electromagnetic means, etc., can solve the problems of poor wear resistance and poor reliability of sensors, and achieve excellent solvent resistance, adjustable conductivity, enhanced The effect of abrasion resistance
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specific Embodiment approach 1
[0025] Specific implementation mode one: the following combination figure 1 Describe this embodiment mode, the resistor body based on carbon film nano conductive material described in this embodiment mode, is characterized in that, it comprises substrate ceramics 1, resistance film 2, metal pad 3 and signal lead-out hole 4;
[0026] The substrate ceramic 1 has a ring-shaped structure, and a metal pad 3 with an opening is printed on the inner surface of the ring of the substrate ceramic 1, and a signal lead-out hole 4 is provided on the substrate ceramic 1 at the opening of the metal pad 3. A resistive film 2 is prepared on the outer surface of the substrate ceramic 1;
[0027] The resistive thin film 2 is a carbon film nano-conductive material prepared based on a carbon-constantan double-target co-sputtering method.
specific Embodiment approach 2
[0028] Specific implementation mode two: the following combination figure 1 , figure 2 and image 3 Describe this embodiment, the preparation method of the resistor body based on the carbon film nano conductive material described in this embodiment, the preparation method is used to prepare the resistor body based on the carbon film nano conductive material, the preparation method includes:
[0029] S1. Using a cast platform to prepare the ceramic powder into a cast film, and then use a cutting machine to cut it into a substrate ceramic 1 according to the set size;
[0030] S2. Making a via hole on the substrate ceramic 1 prepared in S1, and filling the via hole with metal paste to form a signal lead-out hole 4;
[0031] S3, the metal pad 3 is screen-printed, and then sintered to form a cooked porcelain substrate;
[0032] S4. Put the cooked porcelain substrate obtained in S3 into the vacuum coating chamber, and prepare the resistive film 2 of carbon film nano conductive m...
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