Flexible PC board made through a water cleaning process

Inactive Publication Date: 2009-05-28
ULT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]The present invention has been accomplished under the circumstances in view. The main object of the present invention is to provide a flexible printed circuit board which employs a water cleaning process to remove the removable layer instead of conventional etching and acid/alkaline cleaning, thereby simplifying the fabrication, meeting the environmental protection requirements, eliminating wastewater pollution problem, assuring high integrity of the circuit pattern, and increasing the yield rate.
[0008]Another object of the present invention is to provide a flexible printed circuit board by means of a water cleaning pr

Problems solved by technology

Acid/alkaline cleaning causes a wastewater problem.
Because wastewater from acid/alkaline cleaning has a high concentration, its treatment is complicated and very costly.
Further, it brings pollution to the environment.
In

Method used

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  • Flexible PC board made through a water cleaning process
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  • Flexible PC board made through a water cleaning process

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Embodiment Construction

[0017]Referring to the annexed drawings in detail, a flexible printed circuit board made through a water cleaning process in accordance with the present invention comprises a substrate 1, a printed layer 2, and a conduction layer 3.

[0018]The substrate 1 is prepared from polymers or copolymers such as polyethylene terephthalate (PET), polyimide (PI), polypropylene (PP), polystyrene (PS), polymethylmethacrylate (PMMA), polycarbonate (PC), polyurethane (PU), polybutylene terephthalate (PBT), acrylonitrile butadiene styrene (ABS), nylon, etc.

[0019]The printed layer 2, as shown in FIG. 1, is a removable layer prepared from a hydrophilic material that can be either transparent or opaque, and is printed on one side, namely, the top side of the substrate 1 according to a predetermined pattern such that a blank zone 21 not covered by the printed layer 2 is left on the top side of the substrate 1, corresponding to a predetermined circuit pattern. The printed layer 2 is a removable layer printed

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Abstract

A flexible PC board made through a water cleaning process includes a substrate prepared from polymers or copolymers such as PET, PI, PP, PS, PMMA, PC, PU, PBT, ABS, nylon, etc. A release layer prepared from a hydrophilic material and printed on the substrate to leave a blank zone on the substrate according to a predetermined circuit pattern, and a conduction layer bonded to the blank zone to form a circuit pattern. An electroplating process may be employed to increase the thickness of the circuit pattern formed of the conduction layer. Through a water cleaning process, the release layer is removed from the substrate, and the desired flexible PC board is obtained for bonding to a member of an electronic product by means of injection or pressure casting molding.

Description

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Claims

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Application Information

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Owner ULT TECH
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