Thermosetting die-bonding film

7.7 wt % of an acrylic acid ester-based polymer containing ethyl acrylate-methyl methacrylate as a main component (manufactured by Negami Chemical Industrial Co., Ltd., Paracron W-197CM), 18.6 wt % of an epoxy resin A (manufactured by Japan Epoxy Resins Co., Ltd., Epikote 1004), 12.0 wt % of an epoxy resin B (manufactured by Japan Epoxy Resins Co., Ltd., Epikote 827), 21.7 wt % of a phenol resin (manufactured by Mitsui Chemicals, Inc., MILEX XLC-4L), 39.9 wt % of spherical silica (manufactured by ADMATECHS CO., LTD., SO-25R), and 0.1 wt % of a thermosetting catalyst (manufactured by SHIKOKU CHEMICALS CORPORATION, C11-Z) (0.166 parts by weight to 100 parts by weight of an organic component excluding the spherical silica) were dissolved in methyl ethyl ketone to obtain an adhesive composition having a concentration of 23.6% by weight (however, methyl ethyl ketone was excluded from the organic component). The value of (the number of moles of epoxy groups in the thermosetting component of

7.7 wt % of an acrylic acid ester-based polymer containing ethyl acrylate-methyl methacrylate as a main component (manufactured by Negami Chemical Industrial Co., Ltd., Paracron W-197CM), 24.0 wt % of an epoxy resin A (manufactured by Japan Epoxy Resins Co., Ltd., Epikote 1004), 12.0 wt % of an epoxy resin B (manufactured by Japan Epoxy Resins Co., Ltd., Epikote 827), 16.3 wt % of a phenol resin (manufactured by Mitsui Chemicals, Inc., MILEX XLC-4L), 39.9 wt % of spherical silica (manufactured by ADMATECHS CO., LTD., SO-25R), and 0.1 wt % of a thermosetting catalyst (manufactured by SHIKOKU CHEMICALS CORPORATION, C11-Z) (0.166 parts by weight to 100 parts by weight of an organic component excluding the spherical silica) were dissolved in methyl ethyl ketone to obtain an adhesive composition having a concentration of 23.6% by weight (however, methyl ethyl ketone was excluded from the organic component). The value of (the number of moles of epoxy groups in the thermosetting component of

7.7 wt % of an acrylic acid ester-based polymer containing ethyl acrylate-methyl methacrylate as a main component (manufactured by Negami Chemical Industrial Co., Ltd., Paracron W-197CM), 29.4 wt % of an epoxy resin A (manufactured by Japan. Epoxy Resins Co., Ltd., Epikote 1004), 12.0 wt % of an epoxy resin B (manufactured by Japan Epoxy Resins Co., Ltd., Epikote 827), 10.9 wt % of a phenol resin (manufactured by Mitsui Chemicals, Inc., MILEX XLC-4L), 39.9 wt % of spherical silica (manufactured by ADMATECHS CO., LTD., SO-25R), and 0.1 wt % of a thermosetting catalyst (manufactured by SHIKOKU CHEMICALS CORPORATION, C11-Z) (0.166 parts by weight to 100 parts by weight of an organic component excluding the spherical silica) were dissolved in methyl ethyl ketone to obtain an adhesive composition having a concentration of 23.6% by weight (however, methyl ethyl ketone was excluded from the organic component). The value of (the number of moles of epoxy groups in the thermosetting component of