Stripping Gold Components and the Method of Stripping Gold

a technology of gold components and stripping gold, applied in the field of new gold strippers, can solve the problems of not easy to dissolve or corrosion by acid or alkaline solution, traditional stripping gold (or gold dissolution) technology cannot be applied, and the potential risk is quite large for all operators, so as to achieve the effect of quick stripping gold and not affecting the operator or the environmen

Active Publication Date: 2012-11-22
UWIN NANOTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an improved method for removing unwanted metal from surfaces without causing damage. This results in faster removal of metals while also reducing waste and improving efficiency.

Problems solved by technology

The technical problem addressed in this patent is how to develop an effective method that does away with the use of hazardous materials like cyanide while still producing valuable metallic material.

Method used

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Embodiment Construction

[0014]Reference will now be made in detail to the present embodiments of the invention.

[0015]The invention relates to stripping gold components and its application, and particularly to provide stripping gold components for stripping gold from the substrate and the method thereof.

[0016]The invention provides a compound which could strip the gold from the substrate of electronic parts. This compound may consist of one or several stripping gold chemicals, and a conducting chemical. For it phenomenon, the stripping gold compounds could form a covalent bond with Au and then bring the gold from the surface of substrate. And with the assistance of conducting chemical, the working voltage could be controlled as low as no damage to substrate. Cyanide-based chemical is not included.

[0017]In one embodiment, the stripping gold chemical compound comprises a thiocarbamide. Besides, the stripping gold chemical compound could further comprises alkyl sulfate compound, pyridine sulfonic acid compound an

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Abstract

The invention provides a stripping gold component which could remove gold from substrate, comprising: a stripping gold chemical compound; and a assistant conductive compound wherein said stripping gold chemical compound bonds with gold to form covalent bond to strip gold from said substrate, said assistant conductive chemical compound helps the electric conduction and decreases the voltage, said substrate would not be damaged after stripping gold from said substrate, and the stripping gold component is cyanide free.

Description

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Claims

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Application Information

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Owner UWIN NANOTECH
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