Photosensitive resin composition and applications thereof

a technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of high linear thermal expansion coefficient, adversely affecting process accuracy, damage to optical devices, etc., and achieve the effect of low linear thermal expansion coefficient and good cross-sectional shap

Inactive Publication Date: 2014-03-27
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technical effect that this new material solves are its ability to form an effective protection layer with excellent geometrical shapes without causing any changes or warping over time due to temperature variations during use.

Problems solved by technology

This patents describes how it can be difficult if we want to create a strong yet flexible material with excellent properties like durability, flexibility, strength, impact absorption ability, etc., without damaging its sensitive components when exposed to harsh environments over prolonged periods of time due to factors like temperature changes caused by sunlight exposure. Additionally, this technology needs to prevent any unwanted deformation while maintaining precise dimensions through various techniques used to form these materials.

Method used

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  • Photosensitive resin composition and applications thereof
  • Photosensitive resin composition and applications thereof
  • Photosensitive resin composition and applications thereof

Examples

Experimental program
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examples

Preparation of Alkali-Soluble Resin (A)

synthesis example a-1

[0152]A 1000 ml four-necked flask, which is equipped with a nitrogen inlet, a stirrer, a heater, a condenser, and a thermometer, was introduced with nitrogen gas and was added with methacrylic acid (referred as MMA, 10 parts by weight), glycidyl methacrylate (referred as GMA, 65 parts by weight), dicyclopentanyl methacrylate (referred as FA-513M, 15 parts by weight), styrene (referred as SM, 10 parts by weight), and diethylene glycol dimethyl ether as a solvent (referred as Diglyme, 240 parts by weight) to form a mixture.

[0153]When the four-necked flask was filled with nitrogen gas, the mixture was stirred and heated up to 85° C. in an oil bath. A catalyst solution (3.0 parts by weight of 2,2′-azobis(2,4-dimethylvaleronitrile)(referred as ADVN) dissolved in 20 parts by weight of Diglyme) was divided into 5 parts and was added sequentially into the four-necked flask part by part within an hour for inducing a polymerization reaction. The polymerization reaction was then conducted at 70°

synthesis example a-2

[0154]A 1000 ml four-necked flask, which is equipped with a nitrogen inlet, a stirrer, a heater, a condenser, and a thermometer, was introduced with nitrogen gas and was added with 2-methacryloyloxyethyl succinate monoester (referred as HOMS, 40 parts by weight), 3,4-epoxycyclohexylmethyl methacrylate (referred as EC-MAA, 25 parts by weight), 2-hydroxyethyl methacrylate (referred as HEMA, 5 parts by weight), FA-513M (10 parts by weight), SM (20 parts by weight), and propylene glycol monomethyl ether acetate as a solvent (referred as PGMEA, 240 parts by weight) to form a mixture.

[0155]When the four-necked flask was filled with nitrogen gas, the mixture was stirred and heated up to 85° C. in an oil bath. A catalyst solution (2.4 parts by weight of ADVN dissolved in 20 parts by weight of PGMEA) was divided into 5 parts and was added sequentially into the four-necked flask part by part within one hour for inducing a polymerization reaction. The polymerization reaction was then conducted at

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Abstract

A photosensitive resin composition includes: an alkali-soluble resin; an o-naphthoquinonediazidesulfonic acid ester; a silsesquioxane having at least two thiol groups in a molecule; and a solvent. The silsesquioxane is obtained by subjecting to condensation a silane material which includes a thiol-group-containing silane represented by RaSi(ORb)3. Ra represents a C1-C8 organic group that contains a thiol group and that is free from an aromatic group, or an organic group that contains a thiol group and an aromatic group. Rb independently represents hydrogen, a C1-C6 alkyl group, a C1-C6 acyl group, or a C6-C15 aromatic group.

Description

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Claims

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Application Information

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Owner CHI MEI CORP
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