Flow passage device and testing system using the same

[0055]The present invention will be described in detail below with reference to examples.

[0056]FIG. 4 is an explanatory diagram of the present example illustrating a section perpendicular to a flow passage. A second member 31 formed of a lower substrate, and a first member 32 is formed of a glass substrate. The present example also includes a flow passage 33, a plurality of heating resistors 34, a light detector 35, and an insulating layer 36. The lower substrate is formed of a single crystal Si. Single crystal Si is a material to which a variety of processing methods used in the micro electro mechanical system (MEMS) technology can be applied. Use of single crystal Si facilitates processing and control for processing a material into an intended shape. A metal pattern made of gold is formed on the lower substrate as electrically conductive members serving as wiring for the heating resistors 34. The insulating layer 36, which is transparent to wavelengths of light emitted in the flow pa

[0059]FIG. 5 is a schematic diagram of a flow passage device seen from above. The flow passage device includes a substrate 41, inlet / outlet ports 42 through which a viscous fluid flows into or out of a flow passage, a flow passage 43, heating resistors 44 as heating portions, wiring 45, electrode pads 46, a light detector (not shown), and a transparent insulating layer (not shown).

[0060]The present example includes two heating resistors 44 along the flow passage 43. There has been proposed a method of DNA or RNA testing in which amplification using the PCR reaction having been mentioned above is performed and combination with a single-strand, which is labeled with fluorescent dye, or separation from a double-strand, which is labeled with fluorescent dye, is observed. In the present example, an area in which one of the heating resistors 44 is disposed is used as a PCR reaction area, and an area in which the other heating resistor 44 is disposed is used as an analytical area in which a

[0062]FIG. 6 illustrates a section perpendicular to a flow passage. The present example includes a lower substrate 51, an upper substrate 52, a flow passage 53, a heating resistor 54 as the heating portion, a light detector 55, and an insulating layer 56.

[0063]The flow passage 53 is formed in the lower substrate 51. A surface of the flow passage 53 has a continuously curved sectional shape formed by isotropic wet etching. A metal pattern which serves as the heating portion is formed on the flow passage 53. Grooves having depths equal to the film thickness of wiring for the heating portion is formed in the lower substrate 51. The wiring for the heating portion is routed along the grooves. As is the case with the first example, the third example has the insulating layer 56. The upper substrate 52 formed of glass is integrated with the lower substrate 51 using anode bonding so as to overlay the flow passage 53. Pads that have a certain size and used for electrical connection are provided