Packaging structure applied to infrared sensor, and infrared sensor packaging method

[0034]Example 1:

[0035]This embodiment can be applied to pyroelectric sensors, such asfigure 2 The shown packaging structure applied to infrared sensors includes a substrate 5, a sensitive element 7 and a sensitive element supporting circuit 8, a metal cap 1 and a pin 3 provided on the substrate; the side of the substrate is closely attached to the inner wall of the metal cap Close; The metal cap has a 4mm×3mm rectangular receiving window 13 facing the receiving direction, and an infrared filter 4 matching the size of the receiving window is fixedly installed at the receiving window.

[0036]A metal wire is laid on the substrate, and the sensitive element and the sensitive element supporting circuit are electrically connected to the substrate through the metal wire and conductive glue to form a sensor circuit; one end of the pin is fixedly mounted on the substrate and passes The conductive glue 12 is electrically connected to the pad on the substrate, and the other end of the pin is used a

[0043]Example 2:

[0044]The difference from Example 1 is thatimage 3 As shown, in this embodiment, the metal pipe cap has a circular receiving window facing the receiving direction, and an infrared filter matching the size of the receiving window is fixedly installed at the receiving window.

[0045]In addition, one end of the pin is riveted on the substrate, and the other end of the pin is used as the pin of the product of this embodiment.image 3 There are also 3 pins shown in.

[0046]Further, three or more clamping points 10 are provided on the metal pipe cap, which are used to guide and position the loading of the substrate, and the clamping points can realize the metal pipe cap when they are in contact with the land on the substrate. The electrical connection of the metal pipe cap is realized, and the distance between the sensitive element and the infrared filter mounted on the substrate can be ensured to meet the design requirements, and the electromagnetic interference signal can be pro

[0049]Example 3:

[0050]The difference from Example 1 and Example 2 is thatFigure 4As shown, in this embodiment, two positioning posts 11 are provided on the inner side wall of the metal pipe cap. The positioning posts are used as both the installation and positioning structure and the ground connection structure. The positioning posts are made of metal material, which is Both ends of the two positioning posts are installed on the substrate and connected with the substrate through conductive glue; the other ends of the two positioning posts are supported on the inner bottom surface of the metal pipe cap and are connected to the bottom surface of the metal pipe cap. The electrical connection is achieved through conductive glue connection or direct contact; the positioning column can also directly contact the ground wire on the substrate to achieve electrical connection, and is used to realize the grounding of the metal pipe cap. By adjusting the height of the positioning column, the dista