Method for forming negative tone pattern, method for manufacturing electronic device, and active-light-sensitive or radiation-sensitive resin composition

a technology of negative tone pattern and resin composition, which is applied in the direction of photosensitive material processing, photomechanical equipment, instruments, etc., can solve the problems of uneven pattern formation, and deterioration of pattern accuracy

Inactive Publication Date: 2017-07-13
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technical effect described by this patented technology can be improved methods for creating patterns on materials that are sensitive towards light such as photoresists with higher resolution capabilities than traditional lithography techniques while also reducing their size after being exposed during production processes. This results in more precise structures made from these materials.

Problems solved by technology

The technical problem addressed by this patented technology relates to improving image quality when developing patterns with high-quality resolutions at shorter wavelengths (such as 288nm) than traditional methods such as immersion lithography or scanning electron microscopy.

Method used

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  • Method for forming negative tone pattern, method for manufacturing electronic device, and active-light-sensitive or radiation-sensitive resin composition
  • Method for forming negative tone pattern, method for manufacturing electronic device, and active-light-sensitive or radiation-sensitive resin composition
  • Method for forming negative tone pattern, method for manufacturing electronic device, and active-light-sensitive or radiation-sensitive resin composition

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examples

[0558]Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.

Synthesis Example: Synthesis of Polymer (1)

[0559]42.86 parts by mass of cyclohexanone was heated at 80° C. under a nitrogen stream. While stirring this liquid, a mixed solution of 13.33 parts by mass of a monomer represented by the following structural formula M-1, 27.48 parts by mass of a monomer represented by the following structural formula M-2, 79.59 parts by mass of cyclohexanone, and 1.84 parts by mass of dimethyl 2,2′-azobisisobutyrate [V-601, manufactured by Wako Pure Chemical Industries, Ltd.] was added dropwise to the liquid for 6 hours. After completion of the dropwise addition, the mixture was further stirred at 80° C. for 2 hours. After being left to be cooled, the reaction liquid was reprecipitated with a large amount of methanol / water (mass ratio of 90:10) and filtered, and the obtained solid was dried in vacuo to obtai

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Abstract

The present invention has an object to provide a method for forming a negative tone pattern in which DOF of a resist composition used is high and shrinkage of a film in post exposure bake is suppressed; a method for manufacturing an electronic device including the pattern forming method; and an active-light-sensitive or radiation-sensitive resin composition. The method for forming a negative tone pattern of the present invention including: a film formation step of forming a resist film on a substrate, using a resist composition; an exposing step of irradiating the film with active light or radiation; a heating treatment step of performing a heating treatment on the film irradiated with active light or radiation; and a developing step of developing the heating-treated film using a developer including an organic solvent, in which the resist composition includes a resin A having a repeating unit A with a group represented by a specific formula, a resin B having a repeating unit B with a group represented by a specific formula, and a compound that generates an acid upon irradiation with active light or radiation.

Description

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Claims

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Application Information

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Owner FUJIFILM CORP
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