Multi-tier conductive circuits free of supporting substrate with intermediary devices on a plurality of tiers, detachable production platform for additive manufacturing, solder-dispensers and device-dispensers

Pending Publication Date: 2018-11-29
NYSTEDT BO GOSTA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0008]Present innovations only take up the space necessary for the circuits with devices as such and they combine to create a highly flexible conductive circuit solution. They furthermore present ways of making additive manufacturing fit for mass production.
[0009]Central for the innovations presented here is the method for establishing multi-tier conductive circuits free of supporting substrate with intermediary devices attached on a plurality of tiers.
[0010]The manufacturing process for such circuits rely on an additive production unity with a detachable production platform, with the capacity of being re-inserted and firmly fixed in the exact position from

Problems solved by technology

However, the purpose of the shuttle is to cause the closure of the device shaft, and for that to happen, the misalignment must take place.
However, not all shuttles are full size.
The challenge is to identify devices that could be handled by one height and position of a shuttl

Method used

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Example

Second Alternative Embodiment

[0175]In this embodiment the solder pad boxes are made solid, which means that they will consist of the same material as the conductive lines. To attach the devices to such solder pad boxes the laser beams are being utilized the same way as in the first alternative embodiment.

[0176]This procedure will take place in the second building session, which means that the production platform has been detached in order to get devices dispensed to the circuit, where-after the production platform is re-inserted into the additive manufacturing machine to have the devices attached to their solder pad boxes.

[0177]The dispensing of solder material, that took place in the preferred embodiment by the solder-dispenser being fixed on the production platform and the platform afterwards being transferred into a heating device, has become obsolete. This is also the case for the second transferring of the production platform to a heating device; this second heating device was whe

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PUM

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Abstract

Four parts of a unity is described here, centered around the multi-tier conductive circuits. The detachable production platform is a prerequisite for manufacturing of these circuits as described. The solder-dispenser is necessary if the circuits are made of anything but magnetic metal powder, or if the means for containing solder material are made solid, and the device-dispenser replaces conventional pick-n-place machines to provide devices to a circuit much quicker and much cheaper.
The multi-tier conductive circuit that is the central idea and the final product of the presented innovations is highly flexible and highly cost efficient.
The trend of miniaturizing all kinds of electronic equipments has been the outset for these innovations and it is our firm belief that all the industry could benefit highly from such a circuit.

Description

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Claims

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Application Information

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Owner NYSTEDT BO GOSTA
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