The invention relates to the field of
metal surface chemical treatment, in particular to a
copper-containing laminated
etching solution, an
etching method and application thereof. The
etching solutioncomprises a main agent, and by weight, the main agent comprises, 1-20 parts of an
oxidizing agent, 0.01-1 part of a
fluorine ion source, 0.01-5 parts of inorganic acid, 1-15 parts of
organic acid, 1-15 parts of organic alkali, 0.01-5 parts of a
hydrogen peroxide stabilizer, 0.01-1 part of a
metal corrosion inhibitor and the balance
solvent, wherein the total weight parts are 100. The etching solution is low in cost, free of
phosphorus,
environmentally friendly and low in waste liquid treatment cost; cracks at different
metal interfaces can be effectively inhibited; the
copper-containing laminated etching solution has
high copper ion loading capacity, and has excellent etching characteristics, wherein the unilateral CD-Loss is smaller than 0.9
micrometer, and the taper is 35-45 degrees; and the chamfering problem can be solved, bubbles of an insulating layer are effectively avoided, and meanwhile the step of
copper pre-dissolving can be omitted.