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3 results about "Surface chemical" patented technology

Definition of surface chemistry. : a branch of chemistry that deals with the properties of surfaces or phase boundaries and with the chemical changes occurring at a surface or interface.

Preparation method of graphite sheet surface chemical plating iron-nickel alloy layer

InactiveCN104195532AImprove bindingHigh hardnessLiquid/solution decomposition chemical coatingChemical platingGraphite
The invention relates to a preparation method of a graphite sheet surface chemical plating iron-nickel alloy layer. The preparation method comprises the following steps of 1, carrying out degreasing treatment on a graphite sheet; 2, carrying out oxidation treatment on the graphite sheet subjected to degreasing treatment; 3, carrying out the following sensitized treatment on the graphite sheet by utilizing a stannous chloride solution; 4, carrying out activating treatment on the graphite sheet by utilizing a palladium chloride solution; 5, sequentially adding 8-10 parts of C6H5Na3O7.2H2O powder, 4-5 parts of NH4Cl2 powder, 3-6 parts of FeSO4.7H2O powder, 2-3 parts of NiSO4.6H2O powder and 2-4 parts of NaH2PO2.H2O powder into ultra-pure water according to the mass ratio so as to fully dissolve the powder, adopting a NaOH aqueous solution as a pH adjustment solution, and dropwise adding the pH adjustment solution with the pH being controlled in a range of 9-9.5 to prepare a plating solution for surface chemical plating of the graphite sheet; 6, carrying out chemical plating treatment on the graphite sheet subjected to preliminary treatment. The preparation method is convenient in manufacturing and simple in process, and a compact and uniform plating layer with controllable thickness can be obtained on the surface of the graphite sheet.
Owner:TIANJIN UNIV

Copper-containing laminated etching solution, etching method and application thereof

The invention relates to the field of metal surface chemical treatment, in particular to a copper-containing laminated etching solution, an etching method and application thereof. The etching solutioncomprises a main agent, and by weight, the main agent comprises, 1-20 parts of an oxidizing agent, 0.01-1 part of a fluorine ion source, 0.01-5 parts of inorganic acid, 1-15 parts of organic acid, 1-15 parts of organic alkali, 0.01-5 parts of a hydrogen peroxide stabilizer, 0.01-1 part of a metal corrosion inhibitor and the balance solvent, wherein the total weight parts are 100. The etching solution is low in cost, free of phosphorus, environmentally friendly and low in waste liquid treatment cost; cracks at different metal interfaces can be effectively inhibited; the copper-containing laminated etching solution has high copper ion loading capacity, and has excellent etching characteristics, wherein the unilateral CD-Loss is smaller than 0.9 micrometer, and the taper is 35-45 degrees; and the chamfering problem can be solved, bubbles of an insulating layer are effectively avoided, and meanwhile the step of copper pre-dissolving can be omitted.
Owner:JIANGSU HEDA ELECTRONIC TECH CO LTD +1
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