3 results about "Integrated circuit manufacturing" patented technology

The invention relates to a low-halogen low-shrinkage epoxy resin liquid packaging material for manufacturing an integrated circuit. The packaging material is prepared from the following components inpercentage by weight: 30-40% of low-chlorine epoxy resin, 5-10% of organic silicon modified epoxy resin, 12-28% of a toughening agent, 5-10% of a curing agent, 3-6% of an accelerant, 4-8% of a thixotropic agent, 22-35% of a filler, 1-2% of a wetting agent, 1-2% of a defoaming agent and 1-2% of a pigment. The low-viscosity and good-shape-preserving liquid packaging material is convenient for construction and can be cured within 0.5-1 hour at about 120 DEG C. The halogen content of the cured packaging material is less than 800ppm, the curing shrinkage rate is less than 2%, the insulation resistance is greater than 10<14> omega.cm, and the water absorption rate is less than 1%. The packaging material can be widely applied to packaging of integrated circuits of electronic watches, clocks, calculators, household appliances and the like.

An integrated circuit includes a visually discernable indicator formed as part of the integrated circuit to indicate a directionality of a non-visually discernable characteristic of the integrated circuit.