The invention provides a Cu-
Mn alloy film, Cu-
Mn alloy sputtering target material and Cu-
Mn alloy film manufacturing method meeting new requirements for low reflection required by
electrode films or wiring films to improve display quality of plane display elements with
high definition. The Cu-Mn
alloy film is formed by in a way that when
metal component is viewed as 100atom%, the
metal component comprises 32 to45atom% Mn, Cu and unavoidable impurities; visible
light reflectance of the Cu-Mn
alloy film is 30% below; and the reflectance is suitable for the
electrode films or the wiring films for the plane display element.