The invention provides a Cu-Mn alloy film, Cu-Mn alloysputtering target material and Cu-Mn alloy film manufacturing method meeting new requirements for low reflection required by electrode films or wiring films to improve display quality of plane display elements with high definition. The Cu-Mn alloy film is formed by in a way that when metal component is viewed as 100atom%, the metal component comprises 32 to45atom% Mn, Cu and unavoidable impurities; visible light reflectance of the Cu-Mn alloy film is 30% below; and the reflectance is suitable for the electrode films or the wiring films for the plane display element.