Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate

A technology for encapsulating substrates and sintering metal, which is applied in the cutting tools of sawing machines, metal sawing equipment, metal processing equipment, etc., can solve the problems of insufficient online cutting length, reduce production costs, weak diamond holding force, etc., and achieve high processing efficiency. , long service life, good wear resistance

Active Publication Date: 2010-10-27
XIAN DIASH SUPERHARD MATERIALS DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of blade is determined by its properties. When cutting, its radial wear is less than that of the side, and it is easy to form a convex edge shape, so that the actual cutting saw blade becomes relatively thin, which will cause chip shape deformation and problems such as insufficient service life
At present, the division of QFN packaged devices is almost all performed by resin-based diamond saw blades. Due to the characteristics of vertical consumption, the quality of online cutting is excellent, which not only ensures the size and structure of the chip, but also controls the occurrence of ex

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The sintered metal-based diamond saw blade based on the saw cutting QFN packaging substrate, including diamond abrasive grains and metal matrix, the volume percentage concentration of diamond abrasive grains is 55%, the particle size is 38 μm, and the metal matrix is ​​composed of 98 parts by weight of metal powder and 2 parts by weight of inorganic fillers, the metal powder that makes up the metal matrix includes 74 parts by weight of Cu, 17 parts by weight of Sn and 7 parts by weight of Co, the particle size of the above-mentioned metal elemental powders is 45 μm, the inorganic powder that makes up the metal matrix The filler includes 1 part by weight of SiC and 1 part by weight of Al 2 o 3 , SiC and Al 2 o 3 The particle size is 5 μm.

[0017] The matrix composition of the Cu-based diamond saw blade is designed and prepared according to the above composition, and then the metal powders and inorganic fillers that make up the matrix material are mixed evenly and then m

Embodiment 2

[0019] The sintered metal-based diamond saw blade based on the saw cutting QFN packaging substrate, including diamond abrasive grains and metal matrix, the volume percentage concentration of diamond abrasive grains is 60%, the particle size is 45 μm, and the metal matrix is ​​composed of 97 parts by weight of metal powder and 3 parts by weight of inorganic fillers, the metal powder forming the metal matrix includes 80 parts by weight of Cu, 10 parts by weight of Sn and 7 parts by weight of Co, the particle size of the above metal elemental powders is 38 μm, and the inorganic powder forming the metal matrix The filler includes 1 part by weight of SiC and 2 parts by weight of Al 2 o 3 , SiC and Al 2 o 3 The particle size is 6 μm.

[0020] The matrix composition of the Cu-based diamond saw blade is designed and prepared according to the above composition, and then the metal powders and inorganic fillers that make up the matrix material are mixed evenly and then mixed with diamond

Embodiment 3

[0022] The sintered metal-based diamond saw blade based on the saw cutting QFN packaging substrate, including diamond abrasive grains and metal matrix, the volume percentage concentration of diamond abrasive grains is 65%, the particle size is 45 μm, and the metal matrix is ​​composed of 96 parts by weight of metal powder and 4 parts by weight of inorganic fillers, the metal powder forming the metal matrix includes 45 parts by weight of CuSn 20 Pre-alloyed powder, 37 parts by weight of Cu, 6 parts by weight of Sn and 8 parts by weight of Co, the particle size of the above metal elemental powder is 38 μm, CuSn 20 The particle size of the pre-alloyed powder is 45 μm, and the inorganic fillers that make up the metal matrix include 2 parts by weight of SiC and 2 parts by weight of Al 2 o 3 , SiC and Al 2 o 3 The particle size is 7 μm.

[0023] The matrix composition of the Cu-based diamond saw blade is designed and prepared according to the above composition, and then the metal p

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Abstract

The invention discloses a saw-type sintering metal base diamond saw blade for cutting a QFN (Quad Flat Non-leaded) package substrate, which comprises diamond abrasive particles and metal matrix. The metal matrix comprises metal powder and inorganic filler, wherein the metal powder consists of Cu powder, or CuSn20 prealloying powder, Sn powder and Co powder, and the inorganic filler consists of SiC and Al2O3; two series of metal matrix which take Cu and Co as bases are formed according to high-content elements. The qualified metal base diamond saw blade is prepared by the following steps of: firstly, preparing the components of the matrix of the metal base diamond saw blade; and then evenly mixing all the metal powders and the inorganic filler, and then mixing with the diamond abrasive particles; carrying out cold-pressed performing, and then carrying hot-pressed sintering to prepare a metal base diamond saw blade blank; and finally carrying out precision finishing, such as internal and external circle cutting, thickness reducing and the like. The saw-type sintering metal base diamond saw blade has the advantages of high strength and good abrasion resistance, and has the characteristics of high processing efficiency and long service life on the premise of satisfying the quality requirement of on-line chip cutting.

Description

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Claims

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Application Information

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Owner XIAN DIASH SUPERHARD MATERIALS DEV
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