Middle-pressure resin bus heat dissipation hole casting mould

A heat-dissipating hole and resin technology, which is applied in the field of heat-dissipating hole molds, can solve the problems of separation of magnetic components from metal casting molds, loss of positioning, and the shape and size of heat-dissipating holes do not meet the requirements, so as to achieve the effect of easy demoulding.

Inactive Publication Date: 2013-05-08
WETOWN ELECTRIC GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this structure solves the problem of difficult demoulding, it has the following disadvantages: 1. Since the mold core is a hollow cylinder made of elastic material, it is easily deformed under the pressure generated by the gravity of the resin during pouring, resulting in heat dissipation from the pouring. The shape and size of the hole does not meet the requirements; 2. Since the structure uses magnetic components for positioning, if the magnetic positioning encounters mechanical vibration during the production process, it is easy to cause the magnetic components to separate from the metal mold and lose its positioning function, resulting in the pouring of cooling holes The location does not meet the requirements

Method used

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Embodiment Construction

[0040] The medium-voltage resin busbar cooling hole mold involved in the present invention is as follows: Figure 1~3 As shown, it includes a two-layer structure: an outer elastic jacket 1 and an inner metal mold core 2. The elastic jacket 1 has an inner surface 1a with a slope, and the metal mold core 2 has an outer surface with a corresponding slope. On the surface 2a, the metal mold core 2 supports the elastic jacket 1, so that the external dimensions of the elastic jacket 1 remain unchanged. In this way, the shape and dimension accuracy of the poured cooling holes can be ensured.

[0041] For the convenience of assembly and disassembly, the present invention is also provided with a handle 3 , and the handle 3 is installed through the threaded hole 2 b on the upper part of the metal mold core 2 and the handle screw 4 .

[0042] Such as Figure 4 Shown is the poured medium-voltage resin busbar 5, which includes more than one heat dissipation hole 5a and conductive row 5b. ...

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Abstract

The invention provides a middle-pressure resin bus heat dissipation hole casting mould comprising an elastic outer sleeve and a metal mould core, wherein the upper part of the metal mould core is provided with a handle; the outer surface of the metal mould core and the inner surface of the elastic outer sleeve have the same inclined degree; the metal mould core supports the elastic outer sleeve from the inside to keep the shape of the heat dissipation hole; at least two positioning holes are formed in the lower part of the metal mould core and are matched with a positioning pin of a metal casting mould; and the upper part of the metal mould core is pressed by using a pressing plate to guarantee that the heat dissipation hole casting mould does not move in a casting process. According to the middle-pressure resin bus heat dissipation hole casting mould disclosed by the invention, the shape size precision and the position precision of the heat dissipation hole can be accurately guaranteed and the de-molding is very convenient.

Description

technical field [0001] The invention relates to a casting mold for a resin busbar, in particular to a cooling hole mold for casting a medium-voltage resin busbar. Background technique [0002] Due to its excellent protection performance, resin busbars have been more and more widely used in the international and domestic markets in recent years, not only in the field of low-voltage busbars, but also in the field of medium-voltage busbars. However, the pouring process of the medium-voltage resin busbar is very complicated. One of the difficulties is that there are evenly distributed cooling holes between the phases of the medium-voltage resin busbar. Accurate shape and size are required; after the pouring is completed and the resin is cured, the mold is embedded in the cured resin. Due to the bonding force between the surface of the mold and the resin and the pressure generated by the expansion of the resin during the curing process, it is difficult for the mold to get out of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C39/26B29C39/10
Inventor 蒋文功马培锋魏琳李恒生蔡金良黄克锋钟雷
Owner WETOWN ELECTRIC GRP CO LTD
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