All-sulfate tin electroplating additive and plating solution thereof

A technology of pure sulfate and additives, applied in the field of electrochemical deposition of metals and alloys, can solve problems such as increased production costs, unfriendly environment, and environmental pollution in production workshops, and achieve the effects of excellent performance, fine crystallization, and simple sewage treatment

Active Publication Date: 2014-06-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] CN101922026A discloses a methanesulfonic acid-based matt pure tin electroplating additive and its plating solution. The additive contains heterocyclic compounds and amine compounds that are unfriendly to the environment. In addition, the plating solution also contains 100-150g/L of Organic solvents, organic solvents evaporate rapidly in high-speed motion and strong convection, the amount of tin sludge is not well controlled, and the plating solution is easily invalidated, which increases production costs and pollutes the environment of the production workshop
USRE39476E discloses a tin electroplating solution composition, which contains polyalkylene oxide homopolymer and ethylene oxide and propylene oxide copolymer components, and the plating solution needs to be optimized in terms of foaming and defoaming capabilities; at the same time, the patent The medium antioxidant is only one or more of catechol, resorcinol and hydroquinone, which cannot effectively inhibit the black ash brought by the reflow process to tin-plated products

Method used

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  • All-sulfate tin electroplating additive and plating solution thereof
  • All-sulfate tin electroplating additive and plating solution thereof
  • All-sulfate tin electroplating additive and plating solution thereof

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0040] Example 1

[0041] Stannous sulfate 15g / L

[0042] Sulfuric acid 25ml / L

[0043] Polyoxyethylene oxypropylene glycerin (molecular weight 6000) 0.1mg / L

[0044] MO 15 -EO 21 -PO 30 10g / L

[0045] Octanol polyoxyethylene ether (molecular weight 5000) 0.6g / L

[0046] Hydroquinone + malic acid + ascorbic acid (mass ratio 0.8:1:0.2) 25g / L

[0047] temperature 45℃

Example Embodiment

[0048] Example 2

[0049] Stannous sulfate 45g / L

[0050] Sulfuric acid 55ml / L

[0051] Polyoxyethylene oxypropylene glycerin (molecular weight 4000) 80mg / L

[0052] MO 10 -EO 40 -PO 60 25g / L

[0053] Octanol polyoxyethylene ether (molecular weight 8000) 10g / L

[0054] Hydroquinone + malic acid + ascorbic acid (mass ratio 0.8:1:2) 5g / L

[0055] temperature 45℃

Example Embodiment

[0056] Example 3

[0057] Stannous sulfate 75g / L

[0058] Sulfuric acid 85ml / L

[0059] Polyoxyethylene oxypropylene glycerin (molecular weight 8000) 150m g / L

[0060] EO 20 -PO 30 45g / L

[0061] Octanol polyoxyethylene ether (molecular weight 5000) 15 g / L

[0062] Hydroquinone + malic acid + ascorbic acid (mass ratio 0.8:1:2) 40 g / L

[0063] temperature 45℃

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Abstract

The invention discloses an all-sulfate tin electroplating additive and a plating solution thereof. The additive comprises 0.1-200 mg/L defoaming agent, 0.1-50 g/L fine crystal agent, 0.01-20 g/L leveling agent and 0.1-40 g/L antioxidant. The plating solution comprises 5-100 g/L stannous sulfate, 0.1-100 ml/L sulfuric acid, and 0.1-200 mg/L defoaming agent, 0.1-50 g/L fine crystal agent, 0.01-20 g/L leveling agent and 0.1-40 g/L antioxidant used as the additive. The additive disclosed by the invention is free of anionic, cationic and amphoteric surfactants, polyformaldehyde, polyethylene oxide, polypropylene oxide homopolymer, aldehydes, heterocyclic ring compounds, amine compounds, polyaminocarboxylic acid, sulfur amino acids and any organic solvent. The plating solution can be used for obtaining a matte plating with fine crystals and uniform coverage at the on-line speed of 0-800 m/minute.

Description

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Claims

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Application Information

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Owner HARBIN INST OF TECH
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