Improved welding mold for welding semiconductor power module

The invention discloses an improved welding mold for welding a semiconductor power module and belongs to the field of tools and molds for manufacturing semiconductor power devices. The welding mold is obtained through improvement of an original welding mold, stand columns are vertically fixed to the two ends or the periphery of a lengthened welding mold base, the lower end of each stand column is sleeved with an upper backing ring, the upper end of each backing ring is sequentially sleeved with a lower pressing plate, a lower spring, an upper pressing plate and an upper spring, the other end of each upper pressing plate and the other end of each lower pressing plate press an electrode positioning plate and a chip positioning sheet respectively, and an adjusting nut is screwed onto the upper end of each stand column to adjust the pressure of the corresponding upper spring and the corresponding lower spring; each module electrode and each welding mold positioning stand column are sleeved with the electrode positioning plate, a gap bridge compression bar which can move up and down and is provided with a gap bridge compression spring is placed over each gap bridge, and each gap bridge compression bar is guided through a gap bridge compression bar guiding pipe. The welding mold is simple in structural design, practical, small in part number, low in cost increase, convenient to use, and capable of preventing deviation of the gap bridges when solder melts during welding, guaranteeing welding quality and improving the rate of finished products.