Glue overflow preventing technique for PCB packaging process

A kind of PCB board, anti-overflow glue technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of enterprise trouble, unusable, packaging glue overflowing into the hole ring of the circuit board, etc., to achieve the best technical effect, good sealing sexual effect

Inactive Publication Date: 2016-08-10
DONGGUAN JIUXIANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the packaging process of existing chip-type LEDs, the packaging colloid often overflows into the hole ring of the circuit board, which will affect the subsequent soldering opera

Method used

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  • Glue overflow preventing technique for PCB packaging process
  • Glue overflow preventing technique for PCB packaging process
  • Glue overflow preventing technique for PCB packaging process

Examples

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Example Embodiment

[0029] Examples:

[0030] The embodiment of the present invention provides an anti-overflow glue process in the PCB board packaging process, such as figure 1 , figure 2 As shown, the anti-overflow glue process of the PCB board packaging process includes the use of a glue injection mold 1. The glue injection mold 1 is provided with a glue runner 3 for glue injection, and the glue is on the PCB board 2. The glue guide groove 4 with surface flow forming, the process includes the following steps:

[0031] Step 1: Place the PCB board 2 on the glue injection mold 1 and adjust the relative position of the glue injection mold 2 and the PCB board 2 to ensure that the position of the glue guide groove 4 does not cover the hole ring 22 on the PCB board. Prevent the glue in the glue guide groove 4 from overflowing into the orifice ring 22;

[0032] Step 2: Close the injection mold 1 in Step 1, adjust the pressure on the injection mold 1 to 25-50 kg, heat the injection mold 1 to 140°C to 170°C, an

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Abstract

The invention discloses an anti-overflow glue process in the packaging process of PCB boards. The PCB board packaged by this process will not have the phenomenon that the packaging glue overflows into the hole ring of the circuit board, which is beneficial to the soldering operation of the PCB board in the later stage, and can effectively Reduce the phenomenon of poor contact during the welding process and reduce the proportion of defective products.

Description

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Claims

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Application Information

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Owner DONGGUAN JIUXIANG ELECTRONICS
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