Semiconductor device with capacitor

A technology of capacitors and semiconductors, which is applied to semiconductor devices, electric solid devices, semiconductor/solid device components, etc., can solve problems such as mutual interference and waste of wafer area, and achieve the effect of avoiding mutual interference

Inactive Publication Date: 2017-02-15
新昌县峰特年智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This technology uses horizontal capacitor arrangements that allow for more space within an electronic component while reducing electromagnetic interference (EMI). It also includes layers like shieldings or padding to prevent EMI from affecting other components inside it. Additionally, there are specific ways to design these structures with greater flexibility to absorb stresses caused by external factors such as shock loading during manufacturing processes. Overall, this innovation improves performance and reliability of electronics systems.

Problems solved by technology

There have been technical solutions proposed for improving electronic integration processes involving passively element capacitors without causing issues like interference or reduced functionality caused by placement near certain active elements within the chip itself. These techniques include placing special materials called “passivation” layers around specific areas where no active elements were located during production, reducing overlap between different structures while maintaining their functioning capabilities. Additionally, introducing new ways to integrate nonvolatile memory chips onto logic devices reduces unwanted effects from electrostatic coupling and inductitive noise.

Method used

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  • Semiconductor device with capacitor
  • Semiconductor device with capacitor

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Embodiment Construction

[0022] see figure 2 , the present invention provides a semiconductor device with a capacitor, which has a plurality of functional devices 11 on the upper surface of a semiconductor substrate 10, and the functional devices 11 may be transistors; a MIM capacitor formed on the functional device 11; wherein, the The MIM capacitor is perpendicular to the upper surface and covered by an insulating layer 15, the insulating layer is a single silicon oxide material, and a part of the insulating layer 15 is used as a dielectric layer of the capacitor. The MIM capacitor includes a first metal plate 12a and a second metal plate 13a perpendicular to the upper surface and an insulating layer between the first and second metal plates 12a, 13a.

[0023] There is a shielding layer 16 between the MIM capacitor and the functional device 11 , the shielding layer 16 is a grounded metal layer made of conductive hard metal such as copper, titanium, aluminum, nickel and the like.

[0024] A stress buf

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PUM

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Abstract

The invention provides a semiconductor device with a capacitor. The semiconductor device with the capacitor is characterized in that the semiconductor device comprises a semiconductor substrate with opposing upper and lower surfaces, a functional device formed on the upper surface, and a MIM capacitor formed on the functional device. The MIM capacitor is perpendicular to the upper surface.

Description

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Claims

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Application Information

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Owner 新昌县峰特年智能科技有限公司
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