Method for correcting position of solder ball for BGA package

A correction method and position degree technology, which is applied in the direction of assembling printed circuits with electrical components, electrical components, printed circuits, etc., can solve the problem of different time for solder paste to be melted by heat, unstable self-correction of solder ball position, and solder ball position. Exceeding the standard and other problems, to achieve the effect of excellent overall position of the solder balls, avoiding secondary heating rework, and reducing rework steps

Active Publication Date: 2019-03-22
WUXI ZHONGWEI GAOKE ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the BGA circuit size is large, there will be differences in the quality of the solder paste on each pad, and the time for the solder paste to be heated and melted is also different
At this time, the self-calibratio

Method used

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Examples

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Example Embodiment

[0021] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0022] The solder ball position correction method for BGA packaging provided by the present invention includes the following steps:

[0023] Step S1, such as figure 1 As shown, a BGA circuit 2 is provided, and solder paste 1 is printed on the pads of the BGA circuit 2. In this step, the existing mature printing process can be used to print the solder paste 1;

[0024] Step S2, such as figure 2 As shown, the solder ball 3 is placed on the solder paste 2 printed on the BGA circuit through a special fixture; at this time, the position of the solder ball 3 is poor;

[0025] Step S3, such as image 3 As shown, a position correction board 4 is provided, and the position correction board 4 is provided with an array of positioning holes 5; the position distribution of the positioning holes 5 corresponds to the position of the solder balls required for the BGA package of the BGA c

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PUM

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Abstract

The invention provides a method for correcting the position of a solder ball for BGA package. The method comprises the following steps that: a BGA circuit is provided and a solder paste is printed ona bonding pad of the BGA circuit; a solder ball is placed on the solder paste printed on the BGA circuit; a position correction plate is provided, wherein a positioning hole array is formed on the position correction plate and the position distribution of the positioning holes corresponds to positions of solder balls needed by BGA package of the BGA circuit, the positioning holes include semi-circular holes that are formed below through holes and are communicated with through holes and through holes, the apertures of the through holes are smaller than the diameters of the solder balls, and theapertures of the semi-circular holes are larger than the diameters of the solder balls by 0.01mm to 0.02mm; the position correction plate is pasted on the solder balls on the BGA circuit in an aligned manner, wherein the semi-circular holes of the positioning holes fix the corresponding solder balls; and on the basis of the reflow soldering process, reflow soldering is carried out on the BGA circuit and the position correction plate together and then the position correction plate is separated.

Description

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Claims

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Application Information

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Owner WUXI ZHONGWEI GAOKE ELECTRONICS
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