Packaging method and LED packaging structure

A technology of LED encapsulation and encapsulation method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem that the amount of glue cannot be effectively controlled, and achieve the effect of improving the lifespan

Active Publication Date: 2020-07-10
SKYWORTH LCD SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The technology described in this patented allows for precise dosage control during injection of liquids onto an LED lamp holder used with multiple light-emitting diodes (LEDs). This helps prevent damage from exposure or improves its lifespan compared to traditional methods such as dropping solder balls over each other's metal leads before mounting them on circuit boards.

Problems solved by technology

The technical problem addressed in this patented text relates how consistency between the amount used for sealing an LED can affect its lifespan or performance.

Method used

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  • Packaging method and LED packaging structure
  • Packaging method and LED packaging structure
  • Packaging method and LED packaging structure

Examples

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no. 1 example

[0046] like figure 1 As shown, in the first embodiment of the packaging method provided by the present invention, the method includes the following steps:

[0047] Step S10, preparing the solid fluorescent glue 10, the solid fluorescent glue 10 includes a ring-shaped fluorescent glue layer, and the fluorescent glue layer encloses the accommodation cavity 11;

[0048] In the present invention, first prepare the solid fluorescent glue 10, so that the solid fluorescent glue 10 is equivalent to the role of the retaining wall, so that when the first liquid fluorescent glue 30 is injected into the accommodation cavity 11 of the solid fluorescent glue 10, the first liquid fluorescent glue 30 will be blocked by solid fluorescent glue 10.

[0049] Step S20, placing the solid fluorescent glue 10 on the packaging base 20, and injecting the first liquid fluorescent glue 30 into the accommodation cavity 11;

[0050] When injecting the first liquid fluorescent glue 30 into the solid fluoresc

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Abstract

The invention discloses a packaging method and an LED packaging structure, the packaging method is used for preparing the LED packaging structure, the method comprises the steps that solid fluorescentglue is prepared, the solid fluorescent glue comprises an annular fluorescent glue layer, and an accommodating cavity is defined by the fluorescent glue layer; the solid fluorescent glue is placed ona packaging base, and first liquid fluorescent glue is injected into the containing cavity; fixing an LED chip in the cavity in the LED bracket with the cavity; the LED support is inverted, so that the cavity faces the solid fluorescent glue, and the LED support is buckled on the solid fluorescent glue, so that the LED chip is soaked in the liquid fluorescent glue; and after the first liquid fluorescent glue is cured, the packaging base is removed to obtain the LED packaging structure. According to the packaging method of the LED packaging structure provided by the invention, the glue amountin the LED bracket can be effectively controlled.

Description

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Claims

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Application Information

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Owner SKYWORTH LCD SHENZHEN CO LTD
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