Sensor unit, radiation detector and method of manufacturing sensor unit

一种传感器单元、辐射检测器的技术,应用在辐射的测量、辐射控制装置、X /γ/宇宙辐射测量等方向,能够解决解决方案复杂、辐射角度增加、出现遮蔽等问题

Pending Publication Date: 2020-12-04
XCOUNTER AB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this solution is complex and specifies different distances from the object to be imaged for different positions of the detector
Additionally, the radiation angle increases and shadowing may occur

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] Hereinafter, a sensor unit for a radiation detector, a radiation detector including at least one sensor unit, and a method of manufacturing the sensor unit will be described. The same reference numerals will be used to designate the same or similar structural features.

[0046] figure 1 A side view of an imaging device 10 including a radiation detector 12 is schematically represented. The radiation detector 12 of this example is formed from a plurality of sensor units 14 according to the present disclosure. The radiation detector 12 may, for example, include one or more coupling mechanisms that allow the sensor units 14 to be connected together. The coupling mechanism may, for example, connect the support substrates of two adjacent sensor units 14 . The sensor unit 14 can also be connected via an interface circuit.

[0047] However, a radiation detector according to the present disclosure may alternatively comprise only one sensor unit. The imaging device 10 may, f...

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PUM

PropertyMeasurementUnit
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Abstract

A sensor unit (14) for a radiation detector (12), the sensor unit (14) comprising a conversion element (22) comprising a plurality of imaging pixels (30), wherein each imaging pixel (30) is configuredto directly convert radiation into an electrical charge and wherein each imaging pixel (30) comprises a charge collection electrode (28); and a readout substrate (24) comprising a plurality of readout pixels (32), wherein each readout pixel (32) is connected to an associated imaging pixel (30) by means of an interconnection (36) at a connection position on the charge collection electrode (28); wherein each readout pixel (32) has a smaller area than an associated imaging pixel (30) of the plurality of imaging pixels (30); and wherein the connection positions in relation to the charge collection electrodes (28) are varied with respect to a neighboring charge collection electrode (28). A radiation detector (12) and a method of manufacturing a sensor unit (14) are also provided.

Description

technical field [0001] The present disclosure generally relates to sensor units for radiation detectors. In particular, a sensor unit for a radiation detector, a radiation detector comprising at least one sensor unit and a method of manufacturing the sensor unit are provided. Background technique [0002] Direct conversion radiation detectors utilize photoconductors, such as cadmium telluride (CdTe) conversion elements, to capture and convert incident X-ray photons directly into electric charge. The photoconductor sensor module cannot be made arbitrarily large. For this reason, larger radiation detectors need to be built from smaller sensor modules. The smaller sensor modules need to be electrically connected to power supply and readout circuits. In some implementations, standard connections are made by wire bonding from one or more sides of an electronics layer, such as a readout application specific integrated circuit (ASIC) substrate. In this manner, input and output ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01T1/29H01L27/146
CPCG01T1/2928H01L27/14661H01L27/146G01T1/247H01L27/14636H01L27/14659H01L27/1469
Inventor C·乌尔博格
Owner XCOUNTER AB
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