Bone conduction earphone

一种骨传导耳机、耳机的技术，应用在听筒/耳机附件、传感器、传感器零部件等方向，能够解决面板与振动传递层松动、影响骨传导耳机音质音量等问题，达到便于稳定连接、便于驱动音圈工作、提高稳固程度的效果

Active Publication Date: 2021-10-08
SHENZHEN SANDE DACOM ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In general, the panel is bonded to the vibration transmission layer by glue. However, after a period of time, the viscosity of the glue is likely to decrease, resulting in loosening of the panel and the vibration transmission layer. Since the sound vibration is only transmitted by the panel, the panel The tightness of the connection with the vibration transmission layer will indirectly affect the sound quality and volume of bone conduction headphones

Method used

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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0047] The following is attached Figure 1-12 The application is described in further detail.

[0048] The embodiment of the present application discloses a bone conduction speaker, referring to figure 1 , 2 , which includes an open housing 1 and a transducer device 100, the transducer device 100 is elastically connected to a PCB board 5, and is suspended and connected to the housing 1 through the PCB board 5, and the PCB board 5 is used to transmit the energy brought by the transducer device 100. vibration. refer to image 3 , 4 , when the PCB board 5 is in close contact with the vibration transmission layer 8 (such as the vibration transmission layer 8 of the earphone shell 7), the PCB board 5 and the vibration transmission layer 8 form a vibration system, and the vibration system can convert the sound generated by the transducer device 100 The vibrations are transmitted to the hearing system (body tissue or sensory organ). The subject of the human tissue or sensory or...

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PUM

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Abstract

The invention relates to a bone conduction earphone which comprises an earphone shell, the earphone shell is provided with a vibration transmission layer, the bone conduction earphone further comprises a shell and an energy conversion device, the energy conversion device is arranged in the shell, the energy conversion device is elastically connected with a PCB, the energy conversion device is connected to the shell in a suspended mode through the PCB, and the PCB is used for transmitting vibration brought by the energy conversion device. A connecting contact is welded on the PCB, the connecting contact is connected with a voice coil in the transduction device through a metal wire, the PCB is wrapped in the earphone shell, the PCB and a vibration transmission layer of the earphone shell form a vibration system, and the vibration system can transmit sound vibration generated by the transduction device to human tissues. The bone conduction earphone has the effects of improving the sound quality and volume of the bone conduction earphone and conveniently improving the efficiency of assembling the bone conduction earphone, and the positioning assembly is arranged in the earphone shell and used for enabling the PCB to be tightly connected with the vibration transmission layer.

Description

technical field [0001] The present application relates to the technical field of sound propagation, in particular to a bone conduction earphone. Background technique [0002] At present, bone conduction is a way of sound conduction, that is, by converting sound into mechanical vibrations of different frequencies, sound waves are transmitted through the human skull, bone labyrinth, inner ear lymph fluid transmission, spiral device, auditory nerve, and auditory center. Compared with the classic sound conduction method of generating sound waves through the diaphragm, bone conduction saves many steps of sound wave transmission, and can achieve clear sound reproduction in noisy environments, and the sound waves will not be affected by the diffusion in the air. others. [0003] The existing bone conduction loudspeaker includes a transducer and a panel, and the panel is elastically connected to the transducer. When the panel of the bone conduction speaker is wrapped with the vibr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10H04R9/02H04R9/06
CPCH04R1/10H04R1/1091H04R9/02H04R9/06H04R9/025
Inventor 何李平
Owner SHENZHEN SANDE DACOM ELECTRONICS CO LTD
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