Method for forming low defect density alloy graded layers and structure containing such layers

a technology of alloy graded layers and low defect density, which is applied in the direction of capacitors, light-sensitive devices, electrolytic capacitors, etc., can solve the problems of integrating such materials onto conventional substrates, creating defects to accommodate mismatches, and lattice mismatches between deposited layers and underlying conventional substrates

Active Publication Date: 2006-06-01
MASSACHUSETTS INST OF TECH
View PDF10 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present technology describes methods for creating structures made up of two layers: one consisting mostly or entirely of metals called Al (aluminum) and another containing elements like boron which can be easily separated by heat treatment at different temperatures during manufacturing processes. This allows for precise control on how well these materials fit together when used in electronic devices such as transistors.

Problems solved by technology

This patents describes methods used during manufacturing processes involving integrating different types of semiconductor or opaque films with other components like metal electrodes. However, there are challenges associated with this process due to differences in atomic structure caused by crystal structures formed when two layers meet together. These issues can lead to errors called threading displacement disorders which affect device functionality and cause difficulties in handling them properly. To address this problem, research has focused on reducing threading spacing within certain areas around specific interfaces between various layers while also maintaining consistently high levels of atomicity throughout all three dimensions.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for forming low defect density alloy graded layers and structure containing such layers
  • Method for forming low defect density alloy graded layers and structure containing such layers
  • Method for forming low defect density alloy graded layers and structure containing such layers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] This invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,”“comprising,” or “having,”“containing,”“involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.

[0035] In the past, some methods to further reduce threading dislocation density in alloy graded layers have called for undesirable modifications that impose undue limitations on the structure. For example, in the case of silicon germanium, one technique requires that the relaxed silicon germanium graded layer is doped with antimony concentrations greater than ab

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A structure and method of forming same, comprising a low threading density alloy graded layer, deposited according to a deposition temperature profile in correspondence with increasing alloy composition. In one embodiment, a first substantially relaxed alloy graded layer is deposited while varying a deposition temperature according to a first temperature profile. A second substantially relaxed alloy graded layer is deposited over the first graded layer while varying a deposition temperature according to a second temperature profile. Preferably, the minimum signed rate of change of the second temperature profile is less than the maximum signed rate of change of the first temperature profile.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner MASSACHUSETTS INST OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products