Integrated circuit packaging structure and method of making the same

[0025] A scope of the present invention provides an IC packing structure.

[0026] Referring to FIG. 2, FIG. 2 illustrates an outward view of the IC packing structure of the invention. As shown in FIG. 2, the IC packing structure 1 includes a heat-dissipating module 12 and a casing 18.

[0027] Referring to FIG. 3, FIG. 3, a cross-sectional diagram along the A-A line in FIG. 2, illustrates a first preferred embodiment according to the IC packing structure of the invention. As shown in FIG. 3, according to the first preferred embodiment of the invention, the IC packing structure 1 further comprises a semiconductor die 10, a substrate 16, and a protection layer 14. In the first preferred embodiment, the semiconductor die can be a high power semiconductor device.

[0028] The substrate 16 has a first surface, an inner circuit formed on the first surface, a second surface opposite to the first surface, and an outer circuit 13 formed on the second surface. The outer circuit 13 is electrically con