Method for manufacturing semiconductor chips from a semiconductor wafer

[0033]For clarity, the same elements have been designated with the same reference numerals in the different drawings and, further, the various drawings are not to scale.

[0034]FIGS. 5A, 5B, 5C, 6A, 6B, 7A, 7B, and 8A, 8B schematically illustrate steps of a method for manufacturing semiconductor chips, capable of producing, in a production line specifically adapted to process semiconductor wafers arranged on a frame 34 of the type described in relation with FIG. 3, chips arranged on a frame 44 of the type described in relation with FIG. 4, of outer dimensions smaller than those of frame 34.

[0035]FIGS. 5A, 6A, 7A, and 8A are top views, FIG. 5B, 6B, 7B, and 8B respectively are cross-section views along planes B-B of FIGS. 5A, 6A, 7A, and 8A, and FIG. 5C is a bottom view corresponding to FIG. 5A.

[0036]FIGS. 5A, 5B, and 5C illustrate a step during which frames 34 and 44 are superposed, and then fastened to each other.

[0037]In this example, frame 34 comprises three guide rails 51a to 51c p...