Sensor chip and distance measurement device

[0031]2-1. Modification Example 1 (an example in which a pixel separation section is further provided on side of a light entrance surface)

[0032]2-2. Modification Example 2 (an example in which a wiring line is coupled to the pixel separation section)

[0033]2-3. Modification Example 3 (an example in which a semiconductor substrate and an inter-pixel light-blocking film are electrically coupled to each other in a peripheral section)

3. Example of Application

1. Embodiment

[0034]FIG. 1 schematically illustrates an example of a cross-sectional configuration of a sensor chip (a sensor chip 1) according to an embodiment of the present disclosure. FIG. 2 schematically illustrates an example of a planar configuration of a pixel array section R1 of the sensor chip 1 illustrated in FIG. 1. FIG. 3 is a block diagram illustrating a configuration of the sensor chip 1 illustrated in FIG. 1, and FIG. 4 illustrates an example of an equivalent circuit of a pixel P of the sensor chip 1 illustrated in FIG. 1. The sensor chip 1 is configured to be applied to, for example, a distance image sensor (a distance measurement device), an image sensor, or the like that performs distance measurements by a ToF (Time-of-Flight) method.

[0035]The sensor chip 1 includ