Methods of forming integrated circuit devices including a multi-layer poly film cell pad contact hole

[0026]The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout. It will be understood that when an element is referred to as being “on” or “connected to” or “coupled to” another element, it can be directly on, connected to or coupled to the other element or intervening layers or elements may also be present. In contrast, when an element is referred to as being “directly on” or “directly connected to” or “directly coupled to” another element, there are no intervening layers or elements present. The relative thickness of l