Reducing inter-packet gaps in packet-based input/output communications

Inactive Publication Date: 2009-04-14
INTEL CORP
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0005]In accordance with some embodiments, inter-packet gaps in packet based input/output communications may be reduced by determining an indication of a transfer grant for an inbound packet by

Problems solved by technology

However, a receiver may not be able to take an immediate advantage of one or more grants because the receiver may be serving a different requester other than the requester that initiated the earlier request.
Additionally, if more grants than necessary to transmit the packet are issued, they may be discarded, wasting the crossbar bandwidth.
In a s

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reducing inter-packet gaps in packet-based input/output communications
  • Reducing inter-packet gaps in packet-based input/output communications
  • Reducing inter-packet gaps in packet-based input/output communications

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020]An interconnect device, such as a switch 20 shown in FIG. 1A includes an interface 25 operably coupled to an interconnect logic 30 capable of establishing a packet-based data input / output (I / O) communication according to one embodiment of the present invention. The interface 25 may receive an inbound packet 35a within the packet-based I / O data communication over an I / O data link 45a. The switch 20 may selectively route the inbound packet 35a as an outbound packet 35b over another I / O data link 45b based on a packet attribute associated with the inbound packet 35a. Using the I / O data links 45a, 45b, the switch 20 may connect one or more end node devices, such as processor-based devices and I / O devices, forming a network in some embodiments. Examples of the end node devices include single chip processor-based devices or Internet adapters and host computers, such as data servers in application processing and enterprise computing environments.

[0021]In operation, using t

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

In one embodiment, an interconnect device (e.g., a switch) includes an interface operably coupled to an interconnect logic capable of reducing inter-packet gaps in packet -based input/output communications. Based on, at least in part, a packet attribute associated with an inbound packet, the interconnect logic may determine an indication of transfer grant which may be issued in conjunction with a packet relay request, sending packet attribute information in advance of the packet attribute.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner INTEL CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products