The invention relates to a cyanide-free Au-Sn alloy plating solution, a preparing method thereof and a method for conducting plating through the cyanide-free Au-Sn alloy plating solution, and belongs to the field of plating. The cyanide-free Au-Sn alloy plating solution comprises following raw materials and components including 0.01 mol/L-0.08 mol/L of gold ions, 0.02 mol/L-0.24 mol/L of stannous ions, 0.12 mol/L-2.40 mol/L of a stannous ion complex agent, 0.08 mol/L-1.50 mol/L of hydantoin and derivatives of the hydantoin, 0.06 mol/L-2.00 mol/L of sulfite, 0.01 mol/L-0.30 mol/L of a stabilizer and 0.02 mol/L-0.06 mol/L of a stannous ion antioxidant. The cyanide-free Au-Sn alloy plating solution has the beneficial effects that stability is high, components of a plating layer are controllable, the preparing method is simple and convenient, operation is easy, and waste liquid is easy to recycle. The plating solution can be preserved for a long term (two or more months) at the room temperature and therefore the cyanide-free Au-Sn alloy plating solution is expected to be applied to actual production.