Electrochemical stripping solution formula for vacuum ion plating

A technology of deplating solution and ions, which is applied in the field of vacuum ion plating electrochemical deplating solution formula, and can solve problems such as stability defects

Active Publication Date: 2017-12-01
广州市双石金属制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the current domestic coating equipment has defects in stability, and the operation is mostly manual, there

Method used

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  • Electrochemical stripping solution formula for vacuum ion plating
  • Electrochemical stripping solution formula for vacuum ion plating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The vacuum ion plating electrochemical deplating solution formula is 1% adenosine diphosphate, 5% hydrochloric acid, 0.1% sodium silicate, 0.1% EDTA, 2% sodium chloride, 0.1% urotropine, 0.1% triethanolamine, the rest is water.

[0015] When using this formula for stripping, the surface coating of unqualified products will be removed in 30 seconds, and the samples after stripping the surface coating are analyzed by X-ray diffraction, and no coating elements are found, which proves that the film layer is completely stripped; Scanning electron microscope (SEM) tests were performed on the samples after surface coating, and it was found that the substrates were not corroded.

Embodiment 2

[0019] The vacuum ion plating electrochemical deplating solution formula is 5% adenosine triphosphate, 15% sulfuric acid, 1% sodium silicate, 5% EDTA, 20% sodium acetate, 3% urotropine, 1 % of triethanolamine, the rest is ethanol.

[0020] When using this formula for stripping, the surface coating of unqualified products will be removed in 30 seconds, and the samples after stripping the surface coating are analyzed by X-ray diffraction, and no coating elements are found, which proves that the film layer is completely stripped; Scanning electron microscope (SEM) tests were performed on the samples after surface coating, and it was found that the substrates were not corroded.

Embodiment 3

[0022] The vacuum ion plating electrochemical deplating solution formula is 2.5% adenosine diphosphate, 10% nitric acid, 0.5% sodium silicate, 3% EDTA, 10% sodium nitrate, 1.5% urotropine, 0.5 % of triethanolamine, and the rest is a mixed solvent of ethanol and water.

[0023] When using this formula for stripping, the surface coating of unqualified products will be removed in 30 seconds, and the samples after stripping the surface coating are analyzed by X-ray diffraction, and no coating elements are found, which proves that the film layer is completely stripped; Scanning electron microscope (SEM) tests were performed on the samples after surface coating, and it was found that the substrates were not corroded.

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Abstract

The invention discloses an electrochemical stripping solution formula for vacuum ion plating. The electrochemical stripping solution formula for vacuum ion plating comprises, by mass, 1%-5% of adenosine diphosphate or adenosine triphosphoric acid, 5%-15% of strong acid, 0.1%-1% of sodium silicate, 0.1%-5% of EDTA, 2%-20% of salt, 0.1%-3% of urotropin, 0.1%-1% of triethanolamine and the balance solvent. Compared with a traditional stripping solution, the adenosine diphosphate or the adenosine triphosphoric acid is added, the stripping rate is increased through the unique molecular structure of the adenosine diphosphate or the adenosine triphosphoric acid and interaction with a film material, and remarkable improvement is achieved.

Description

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Claims

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Application Information

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Owner 广州市双石金属制品有限公司
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